Front-side busThe front-side bus (FSB) is a computer communication interface (bus) that was often used in Intel-chip-based computers during the 1990s and 2000s. The EV6 bus served the same function for competing AMD CPUs. Both typically carry data between the central processing unit (CPU) and a memory controller hub, known as the northbridge. Depending on the implementation, some computers may also have a back-side bus that connects the CPU to the cache. This bus and the cache connected to it are faster than accessing the system memory (or RAM) via the front-side bus.
O-ringAn O-ring, also known as a packing or a toric joint, is a mechanical gasket in the shape of a torus; it is a loop of elastomer with a round cross-section, designed to be seated in a groove and compressed during assembly between two or more parts, forming a seal at the interface. The O-ring may be used in static applications or in dynamic applications where there is relative motion between the parts and the O-ring. Dynamic examples include rotating pump shafts and hydraulic cylinder pistons.
Back-side busIn personal computer microprocessor architecture, a back-side bus (BSB), or backside bus, was a computer bus used on early Intel platforms to connect the CPU to CPU cache memory, usually off-die L2. If a design utilizes it along with a front-side bus (FSB), it is said to use a dual-bus architecture, or in Intel's terminology Dual Independent Bus (DIB) architecture. The back-side bus architecture evolved when newer processors like the second-generation Pentium III began to incorporate on-die L2 cache, which at the time was advertised as Advanced Transfer Cache, but Intel continued to refer to the Dual Independent Bus till the end of Pentium III.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Semiconductor packageA semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure.
Back painBack pain is pain felt in the back. It may be classified as neck pain (cervical), middle back pain (thoracic), lower back pain (lumbar) or coccydynia (tailbone or sacral pain) based on the segment affected. The lumbar area is the most common area affected. An episode of back pain may be acute, subacute or chronic depending on the duration. The pain may be characterized as a dull ache, shooting or piercing pain or a burning sensation. Discomfort can radiate to the arms and hands as well as the legs or feet, and may include numbness or weakness in the legs and arms.
StereolithographyStereolithography (SLA or SL; also known as vat photopolymerisation, optical fabrication, photo-solidification, or resin printing) is a form of 3D printing technology used for creating models, prototypes, patterns, and production parts in a layer by layer fashion using photochemical processes by which light causes chemical monomers and oligomers to cross-link together to form polymers. Those polymers then make up the body of a three-dimensional solid.
Low back painLow back pain (LBP) or lumbago is a common disorder involving the muscles, nerves, and bones of the back, in between the lower edge of the ribs and the lower fold of the buttocks. Pain can vary from a dull constant ache to a sudden sharp feeling. Low back pain may be classified by duration as acute (pain lasting less than 6 weeks), sub-chronic (6 to 12 weeks), or chronic (more than 12 weeks). The condition may be further classified by the underlying cause as either mechanical, non-mechanical, or referred pain.
3D printing3D printing or additive manufacturing is the construction of a three-dimensional object from a CAD model or a digital 3D model. It can be done in a variety of processes in which material is deposited, joined or solidified under computer control, with material being added together (such as plastics, liquids or powder grains being fused), typically layer by layer. In the 1980s, 3D printing techniques were considered suitable only for the production of functional or aesthetic prototypes, and a more appropriate term for it at the time was rapid prototyping.
Seal (mechanical)A mechanical seal is a device that helps join systems and mechanisms together by preventing leakage (e.g. in a pumping system), containing pressure, or excluding contamination. The effectiveness of a seal is dependent on adhesion in the case of sealants and compression in the case of gaskets. The seals are installed in pumps in a wide range of industries including chemicals, water supply, paper production, food processing and many other applications. A stationary seal may also be referred to as 'packing'.
