Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Passive daytime radiative coolingPassive daytime radiative cooling (PDRC) is a renewable cooling method proposed as a solution to global warming of enhancing terrestrial heat flow to outer space through the installation of thermally-emissive surfaces on Earth that require zero energy consumption or pollution. Because all materials in nature absorb more heat during the day than at night, PDRC surfaces are designed to be high in solar reflectance (to minimize heat gain) and strong in longwave infrared (LWIR) thermal radiation heat transfer through the atmosphere's infrared window (8–13 μm) to cool temperatures during the daytime.
Through-silicon viaIn electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
Heat pumpA heat pump is a device that uses work to transfer heat from a cool space to a warm space by transferring thermal energy using a refrigeration cycle, cooling the cool space and warming the warm space. In cold weather a heat pump can move heat from the cool outdoors to warm a house; the pump may also be designed to move heat from the house to the warmer outdoors in warm weather. As they transfer heat rather than generating heat, they are more energy-efficient than other ways of heating a home.
Water coolingWater cooling is a method of heat removal from components and industrial equipment. Evaporative cooling using water is often more efficient than air cooling. Water is inexpensive and non-toxic; however, it can contain impurities and cause corrosion. Water cooling is commonly used for cooling automobile internal combustion engines and power stations. Water coolers utilising convective heat transfer are used inside high-end personal computers to lower the temperature of CPUs and other components.
Radiative coolingIn the study of heat transfer, radiative cooling is the process by which a body loses heat by thermal radiation. As Planck's law describes, every physical body spontaneously and continuously emits electromagnetic radiation. Radiative cooling has been applied in various contexts throughout human history, including ice making in India and Iran, heat shields for spacecraft, and in architecture. In 2014, a scientific breakthrough in the use of photonic metamaterials made daytime radiative cooling possible.
Cooling towerA cooling tower is a device that rejects waste heat to the atmosphere through the cooling of a coolant stream, usually a water stream, to a lower temperature. Cooling towers may either use the evaporation of water to remove process heat and cool the working fluid to near the wet-bulb air temperature or, in the case of dry cooling towers, rely solely on air to cool the working fluid to near the dry-bulb air temperature using radiators.
Heat equationIn mathematics and physics, the heat equation is a certain partial differential equation. Solutions of the heat equation are sometimes known as caloric functions. The theory of the heat equation was first developed by Joseph Fourier in 1822 for the purpose of modeling how a quantity such as heat diffuses through a given region. As the prototypical parabolic partial differential equation, the heat equation is among the most widely studied topics in pure mathematics, and its analysis is regarded as fundamental to the broader field of partial differential equations.
Condenser (heat transfer)In systems involving heat transfer, a condenser is a heat exchanger used to condense a gaseous substance into a liquid state through cooling. In so doing, the latent heat is released by the substance and transferred to the surrounding environment. Condensers are used for efficient heat rejection in many industrial systems. Condensers can be made according to numerous designs, and come in many sizes ranging from rather small (hand-held) to very large (industrial-scale units used in plant processes).
Thermal insulationThermal insulation is the reduction of heat transfer (i.e., the transfer of thermal energy between objects of differing temperature) between objects in thermal contact or in range of radiative influence. Thermal insulation can be achieved with specially engineered methods or processes, as well as with suitable object shapes and materials. Heat flow is an inevitable consequence of contact between objects of different temperature.
