Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
Programmable logic deviceA programmable logic device (PLD) is an electronic component used to build reconfigurable digital circuits. Unlike digital logic constructed using discrete logic gates with fixed functions, a PLD has an undefined function at the time of manufacture. Before the PLD can be used in a circuit it must be programmed to implement the desired function. Compared to fixed logic devices, programmable logic devices simplify the design of complex logic and may offer superior performance.
Central processing unitA central processing unit (CPU)—also called a central processor or main processor—is the most important processor in a given computer. Its electronic circuitry executes instructions of a computer program, such as arithmetic, logic, controlling, and input/output (I/O) operations. This role contrasts with that of external components, such as main memory and I/O circuitry, and specialized coprocessors such as graphics processing units (GPUs). The form, design, and implementation of CPUs have changed over time, but their fundamental operation remains almost unchanged.
Power-on resetA power-on reset (PoR, POR) generator is a microcontroller or microprocessor peripheral that generates a reset signal when power is applied to the device. It ensures that the device starts operating in a known state. In VLSI devices, the power-on reset (PoR) is an electronic device incorporated into the integrated circuit that detects the power applied to the chip and generates a reset impulse that goes to the entire circuit placing it into a known state.
System in a packageA system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc.
Qualcomm SnapdragonSnapdragon is a suite of system on a chip (SoC) semiconductor products for mobile devices designed and marketed by Qualcomm Technologies Inc. The Snapdragon's central processing unit (CPU) uses the ARM architecture. A single SoC may include multiple CPU cores, an Adreno graphics processing unit (GPU), a Snapdragon wireless modem, a Hexagon digital signal processor (DSP), a Qualcomm Spectra and other software and hardware to support a smartphone's global positioning system (GPS), camera, video, audio, gesture recognition and AI acceleration.
MicroprocessorA microprocessor is a computer processor where the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit (CPU). The IC is capable of interpreting and executing program instructions and performing arithmetic operations.
Scratchpad memoryScratchpad memory (SPM), also known as scratchpad, scratchpad RAM or local store in computer terminology, is an internal memory, usually high-speed, used for temporary storage of calculations, data, and other work in progress. In reference to a microprocessor (or CPU), scratchpad refers to a special high-speed memory used to hold small items of data for rapid retrieval. It is similar to the usage and size of a scratchpad in life: a pad of paper for preliminary notes or sketches or writings, etc.
Vision processing unitA vision processing unit (VPU) is (as of 2023) an emerging class of microprocessor; it is a specific type of AI accelerator, designed to accelerate machine vision tasks. Vision processing units are distinct from video processing units (which are specialised for video encoding and decoding) in their suitability for running machine vision algorithms such as CNN (convolutional neural networks), SIFT (scale-invariant feature transform) and similar.
Apple siliconApple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of Mac, iPhone, iPad, Apple TV, Apple Watch, AirPods, AirTag, HomePod, and Apple Vision Pro devices. Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020. The first Macs built with the Apple M1 chip were unveiled on November 10, 2020. As of June 2023, the entire Mac lineup uses Apple silicon chips.
