Future challenges and need for research in timber engineering
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The bond properties between concrete and steel reinforcement influence structural stiffness and deformation behavior as a result of tension stiffening. In specific cases, the load-bearing capacity of engineering structures depends on the deformation behavi ...
Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...
This presentation presents our reserach into the design and potential applications of CNC fabricated snap-fit joints for cross-laminated veneer lumber panels (LVL). These joints are new to the building construction sector, but commonly used in other domain ...
The present work investigates an innovative class of timber structure with potential applications in roofing, facade and bridge construction, called Timberfabric. The development of Timberfabric structures originates from the approach of harnessing the str ...
The present work deals with the large-scale application of the friction welding bonding technology on timber. The investigations that are described in the following were carried out on a prototype of a welding machine that was previously developed for the ...
Practical and material orientated academic research has become increasingly important for architectural practice. This is due to several reasons. First of all, it contributes to contemporary concepts in architecture and improves their implementation. Today ...
Good quality ab initio calcns. (MP2) show that the water adducts of BX3 and CX3+ have totally different structures (X = F-I). While all H2O-BX3 complexes have classical Cs sym. structures with strong B-O bonds and addnl. H-bonding, the heavier CX3+ cations ...
In recent years, the necessity of using renewable resources and sustainable solutions in the building sector has become obvious, and interest in timber as a building material has revived. Novel timber-derived products, such as massif block panels, have eme ...
We introduce a new low temperature (280 °C) parylene-C wafer bonding technique, where parylene-C bonds directly a Pyrex wafer to a silicon wafer with either a Si, SiO2 or Si3N4 surface with a bonding strength up to 23 MPa. The technique uses a single layer ...
This presentation presents our reserach into the design and potential applications of CNC fabricated snap-fit joints for cross-laminated veneer lumber panels (LVL). These joints are new to the building construction sector, but commonly used in other domain ...