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Thick-film technology has found applications on miniaturised hybrid circuits in various fields (automotive electronics, televisions, ...). This technology is also now widely used for the fabrication of force and pressure sensors that use the piezoresistive ...
Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...
Institut de Microtechnique, Université de Neuchâtel2009
Force and pressure sensing technology applied to smart surgical instruments as well as implants allow to give a direct feedback of loads to the surgeon lead to better reliability and success of surgical operations. A common technology used for sensors is l ...
Anewanalytical modeling approach for piezoelectric bending elements is described. The approach is based on the beam theory under quasi-static equilibrium condition. It uses the theory of superposition of piezoelectric action in the bender and external mome ...
The motivation of this study is the need for fundamental understanding of the effects of processing conditions on the electrical properties of low- temperature co-fired ceramic (LTCC) tapes, those screen printed with commercial thick-film pastes of electro ...
