Underfloor heatingUnderfloor heating and cooling is a form of central heating and cooling that achieves indoor climate control for thermal comfort using hydronic or electrical heating elements embedded in a floor. Heating is achieved by conduction, radiation and convection. Use of underfloor heating dates back to the Neoglacial and Neolithic periods. Underfloor heating has a long history back into the Neoglacial and Neolithic periods.
Water heatingWater heating is a heat transfer process that uses an energy source to heat water above its initial temperature. Typical domestic uses of hot water include cooking, cleaning, bathing, and space heating. In industry, hot water and water heated to steam have many uses. Domestically, water is traditionally heated in vessels known as water heaters, kettles, cauldrons, pots, or coppers. These metal vessels that heat a batch of water do not produce a continual supply of heated water at a preset temperature.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Central heatingA central heating system provides warmth to a number of spaces within a building from one main source of heat. It is a component of heating, ventilation, and air conditioning (short: HVAC) systems, which can both cool and warm interior spaces. A central heating system has a furnace that converts fuel or electricity to heat. The heat is circulated through the building either by fans forcing heated air through ducts, circulation of low-pressure steam to radiators in each heated room, or pumps that circulate hot water through room radiators.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Electric heatingElectric heating is a process in which electrical energy is converted directly to heat energy. Common applications include space heating, cooking, water heating and industrial processes. An electric heater is an electrical device that converts an electric current into heat. The heating element inside every electric heater is an electrical resistor, and works on the principle of Joule heating: an electric current passing through a resistor will convert that electrical energy into heat energy.
Transistor countThe transistor count is the number of transistors in an electronic device (typically on a single substrate or "chip"). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in the cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observed that the transistor count doubles approximately every two years.
High-electron-mobility transistorA high-electron-mobility transistor (HEMT or HEM FET), also known as heterostructure FET (HFET) or modulation-doped FET (MODFET), is a field-effect transistor incorporating a junction between two materials with different band gaps (i.e. a heterojunction) as the channel instead of a doped region (as is generally the case for a MOSFET). A commonly used material combination is GaAs with AlGaAs, though there is wide variation, dependent on the application of the device.
History of computing hardware (1960s–present)The history of computing hardware starting at 1960 is marked by the conversion from vacuum tube to solid-state devices such as transistors and then integrated circuit (IC) chips. Around 1953 to 1959, discrete transistors started being considered sufficiently reliable and economical that they made further vacuum tube computers uncompetitive. Metal–oxide–semiconductor (MOS) large-scale integration (LSI) technology subsequently led to the development of semiconductor memory in the mid-to-late 1960s and then the microprocessor in the early 1970s.
Transistor computerA transistor computer, now often called a second-generation computer, is a computer which uses discrete transistors instead of vacuum tubes. The first generation of electronic computers used vacuum tubes, which generated large amounts of heat, were bulky and unreliable. A second-generation computer, through the late 1950s and 1960s featured circuit boards filled with individual transistors and magnetic-core memory. These machines remained the mainstream design into the late 1960s, when integrated circuits started appearing and led to the third-generation computer.
