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High-efficiency non-ablative UV laser nano-scale processing of fused silica by stable filamentation

Related publications (32)

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This work presents the fabrication and analysis of suspended thin film Lithium Niobate resonators. The yield of the new fabrication process presented below is >90% showing devices with high k(t)(2) of 28% resonators at 5GHz, making them suitable for high f ...

IEEE2021

Microstereolithography is a 3D microfabrication technology that is fundamentally different from the techniques commonly used in cleanroom environment for the manufacturing of MEMS components. Most microfabrication techniques evolved from the microelectroni ...

Elsevier / William Andrew Publishing2019

Mask-aligner photolithography is a technology used to replicate patterns from a mask to a photosensitive substrate. It is widely used in the fabrication of MEMS and micro-optical components, and for other applications with dimensions in the micrometer rang ...

EPFL2018

High power modular LED-based illumination system for lithography applications

Hans Peter Herzig, Marcel Groccia, Toralf Scharf, Wilfried Noell, Raoul Kirner, Johana Bernasconi

Mask-aligner lithography is a technology used to transfer patterns with critical dimensions in the micrometer range from below 1 micron for contact printing to a dozen of microns in proximity printing. This technology is widely used in the fabrication of M ...

2018

Post-cmos processing and 3d integration based on dry-film lithography

Carlotta Guiducci, Yusuf Leblebici, Yüksel Temiz

A method for performing a post processing pattern on a diced chip having a foot-print, comprises the steps of providing a support wafer; applying a first dry film photoresist to the support wafer; positioning a mask corresponding to the footprint of the di ...

2015

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A new and versatile fabrication process of insulated gold tip probes for atomic force microscopy (AFM) is presented by Wu et al. (In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments, in: 2013 IEEE 26th International C ...

Elsevier2014

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This paper presents a chip-level postcomplementary metal oxide semiconductor (CMOS) processing technique for 3-D integration and through-silicon-via (TSV) fabrication. The proposed technique is based on dry-film lithography, which is a low-cost and simple ...

Ieee-Inst Electrical Electronics Engineers Inc2013

In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments

Nico de Rooij, Terunobu Akiyama, Sebastian Gautsch, Peter Van der Wal, Yexian Wu

In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reacti ...

IEEE2013

Encapsulated Low Frequency Vibrating Body Field Effect Resonator

Marion Hermersdorf

Resonators for time and frequency reference applications are essential elements found in most electronic devices surrounding us. The continuous minimization and ubiquitous distribution of such electronic devices and circuits demands for resonators of small ...

EPFL2013

Deep-ultraviolet picosecond flat-top pulses by chirp-matched sum frequency generation

Christoph Peter Hauri

Picosecond, flat-top, deep-UV pulses are needed to generate high-brightness electron beams to efficiently drive x-ray free electron lasers. Current metal photocathodes have low efficiency and therefore require high-energy pulses, and the generation of high ...

2012

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