Fiber-optic communicationFiber-optic communication is a method of transmitting information from one place to another by sending pulses of infrared or visible light through an optical fiber. The light is a form of carrier wave that is modulated to carry information. Fiber is preferred over electrical cabling when high bandwidth, long distance, or immunity to electromagnetic interference is required. This type of communication can transmit voice, video, and telemetry through local area networks or across long distances.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Dual in-line packageIn microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
Data centerA data center (American English) or data centre (Commonwealth English) is a building, a dedicated space within a building, or a group of buildings used to house computer systems and associated components, such as telecommunications and storage systems. Since IT operations are crucial for business continuity, it generally includes redundant or backup components and infrastructure for power supply, data communication connections, environmental controls (e.g., air conditioning, fire suppression), and various security devices.
Multi-mode optical fiberMulti-mode optical fiber is a type of optical fiber mostly used for communication over short distances, such as within a building or on a campus. Multi-mode links can be used for data rates up to 100 Gbit/s. Multi-mode fiber has a fairly large core diameter that enables multiple light modes to be propagated and limits the maximum length of a transmission link because of modal dispersion. The standard G.651.1 defines the most widely used forms of multi-mode optical fiber.
Valve amplifierA valve amplifier or tube amplifier is a type of electronic amplifier that uses vacuum tubes to increase the amplitude or power of a signal. Low to medium power valve amplifiers for frequencies below the microwaves were largely replaced by solid state amplifiers in the 1960s and 1970s. Valve amplifiers can be used for applications such as guitar amplifiers, satellite transponders such as DirecTV and GPS, high quality stereo amplifiers, military applications (such as radar) and very high power radio and UHF television transmitters.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Pin grid arrayA pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
Green computingGreen computing, green IT (Information Technology), or ICT sustainability, is the study and practice of environmentally sustainable computing or IT. The goals of green computing are similar to green chemistry: reduce the use of hazardous materials, maximize energy efficiency during the product's lifetime, increase the recyclability or biodegradability of defunct products and factory waste. Green computing is important for all classes of systems, ranging from handheld systems to large-scale data centers.
Mathematical optimizationMathematical optimization (alternatively spelled optimisation) or mathematical programming is the selection of a best element, with regard to some criterion, from some set of available alternatives. It is generally divided into two subfields: discrete optimization and continuous optimization. Optimization problems arise in all quantitative disciplines from computer science and engineering to operations research and economics, and the development of solution methods has been of interest in mathematics for centuries.
