Heat exchangerA heat exchanger is a system used to transfer heat between a source and a working fluid. Heat exchangers are used in both cooling and heating processes. The fluids may be separated by a solid wall to prevent mixing or they may be in direct contact. They are widely used in space heating, refrigeration, air conditioning, power stations, chemical plants, petrochemical plants, petroleum refineries, natural-gas processing, and sewage treatment.
TurbomachineryTurbomachinery, in mechanical engineering, describes machines that transfer energy between a rotor and a fluid, including both turbines and compressors. While a turbine transfers energy from a fluid to a rotor, a compressor transfers energy from a rotor to a fluid. These two types of machines are governed by the same basic relationships including Newton's second Law of Motion and Euler's pump and turbine equation for compressible fluids.
Thermal design powerThe thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component (often a CPU, GPU or system on a chip) that the cooling system in a computer is designed to dissipate under any workload. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating. Intel has introduced a new metric called scenario design power (SDP) for some Ivy Bridge Y-series processors.
Thermal resistanceThermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. (Absolute) thermal resistance R in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. Specific thermal resistance or thermal resistivity Rλ in kelvin–metres per watt (K⋅m/W), is a material constant.
Computer coolingComputer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Thermal massIn building design, thermal mass is a property of the mass of a building that enables it to store heat and provide inertia against temperature fluctuations. It is sometimes known as the thermal flywheel effect. The thermal mass of heavy structural elements can be designed to work alongside a construction's lighter thermal resistance components to create energy efficient buildings.
Heat recovery ventilationHeat recovery ventilation (HRV), also known as mechanical ventilation heat recovery (MVHR), is an energy recovery ventilation system that operates between two air sources at different temperatures. It's a method that is used to reduce the heating and cooling demands of buildings. By recovering the residual heat in the exhaust gas, the fresh air introduced into the air conditioning system is preheated (or pre-cooled), and the fresh air's enthalpy is reduced before it enters the room, or the air cooler of the air conditioning unit performs heat and moisture treatment.
Plate tectonicsPlate tectonics (from the tectonicus, from the τεκτονικός) is the scientific theory that Earth's lithosphere comprises a number of large tectonic plates which have been slowly moving since about 3.4 billion years ago. The model builds on the concept of continental drift, an idea developed during the first decades of the 20th century. Plate tectonics came to be accepted by geoscientists after seafloor spreading was validated in the mid-to-late 1960s.
