Publication

Experimental and numerical studies on size and constraining effects in lead-free solder joints

Related publications (63)

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

John Botsis, Matteo Galli, Joël Cugnoni, Venkatesh Sivasubramaniam

The current study proposes a combined experimental and modeling approach to characterize the mechanical response of composite lead-free solders. The influence of the reinforcement volume fraction on the shear response of the solder material in the joint is ...

Springer US2009

Monitoring of hygrothermal ageing effects in an epoxy resin using FBG sensor: A methodological study

John Botsis, Joël Cugnoni, Dimitrios Karalekas

This study demonstrates the feasibility of using fibre Bragg grating (FBG) sensors to monitor the effects of hygrothermal ageing on the axial strains in a cylindrical epoxy specimen with a centrally located optical glass fibre. A 24 mm long FBG, inscribed ...

Elsevier2009

Characterization of the Residual Stresses and Strength of Ceramic-Metal Braze Joints

John Botsis, Matteo Galli

Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...

2009

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008

Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...

Springer US2008

A deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application, SwissCube’s motherboard (MB). Since 2006, using Pb in consumer electronics has been banned. Aerospac ...

2008

Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...

IEEE2008

, , , , ,

We report on the patterning and characterization of titanium–gold (Ti–Au) wire test structures on polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and polyimide (PI) substrates. PEN, PET and PI are flexible polymers which can withstand stre ...

Elsevier2008

T0004 / Soldering wires to sensor contact pads

Thomas Maeder

The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...

EPFL2008