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This paper reports on the encapsulation of a piezoresistive silicon/Pyrex liquid flow sensor using metal to glass anodic bonding. The bonding technique allowed integrating robust metallic microfluidic interconnects and eliminating the use of glue and O-rin ...
Software fine-grain distributed shared memory (FGDSM) provides a simplified shared-memory programming interface with minimal or no hardware support. Originally software FGDSMs targeted uniprocessor-node parallel machines. This paper presents Sirocco, a fam ...
Prior research indicates that there is much spatial variation in applications' memory access patterns. Modern memory systems, however, use small fixed-size cache blocks and as such cannot exploit the variation. Increasing the block size would not only proh ...
In this paper we compare and contrast two techniques to improve capacity/conflict miss traffic in CC-NUMA DSM clusters. Page migration/replication optimizes read-write accesses to a page used by a single processor by migrating the page to that processor an ...
This thesis presents a specialization of the integral equation (IE) method for the analysis of three-dimensional metallic and dielectric structures embedded in laterally unbounded (open) layered media. The method remains basically spatial but makes use of ...
The paper describes a modeling tool for the design of a new air-cored current transformer called PRiME (planar Rogowski current measurement) designed on a printed-circuit board (PCB) with the coil made of the PCB printed copper layers. The PRiME technology ...
The present work has been focused on the development of analytical and numerical techniques for the analysis of highly convoluted antennas and microwave devices including fractal shaped antennas. The accurate prediction of the frequency response of a high- ...
We have fabricated two-dimensional inductive devices by integrating micropatterned magnetic foils of high permeability (µr=100000) with winding patterns realised in printed circuit boards (PCBs) and flex-foil technology. We realise relatively high inductan ...
This paper describes the fabrication and characterisation of 2-dimensional inductive devices integrated inside printed circuit boards . PCB and flex-foils. These devices basically are composed of three layers of which the outer layers bear the printed coil ...
LTCC technology is based on sintering of multi-layered thick-film sheets (50-250 µm) or so-called green tapes, which are screen-printed with thick-film pastes such as conductors, resistors, etc. The terms low temperature and co-fired originate from the rel ...
