Publication

Hybrid soft-rigid electrical interconnection system

Related publications (6)

Gallium-Based Thin Films for Wearable Sensors and Electronic Skins

Integrated wearable electronics capable of providing biophysical information on complex and dynamic systems have attracted high interest in diverse fields such as healthcare, gaming and robotics. Wearable sensors can create artificial, electronic skins wit ...

EPFL2020

Stretchable metallization technologies for skin-like transducers

Hadrien Olivier Michaud

The skin is not only the largest human organ, capable of accomplishing distributed and multimodal sensing functions. Replicating the versatility of skin artificially is a significant challenge, not only in terms of signal processing but also in mechanics. ...

EPFL2017

Hardware Architecture and Cutting-Edge Assembly Process of a Tiny Curved Compound Eye

Dario Floreano, Ramon Pericet Camara, Géraud L'Eplattenier

The demand for bendable sensors increases constantly in the challenging field of soft and micro-scale robotics. We present here, in more detail, the flexible, functional, insect-inspired curved artificial compound eye (CurvACE) that was previously introduc ...

Mdpi Ag2014

Decreasing the size of printed comb electrodes by the introduction of a dielectric interlayer for capacitive gas sensors on polymeric foil: Modeling and fabrication

Nico de Rooij, Danick Briand, Francisco Molina Lopez

In this work we present a novel strategy to fabricate printed comb electrodes devices with decreased size by the introduction of a thin dielectric layer between the two combs. The electrical insulation of the two polarities prevents short-cuts occurring be ...

Elsevier2013

Correlation of microstructural and mechanical properties in particle reinforced lead-free solders

Venkatesh Sivasubramaniam

Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...

EPFL2009

Laser Sealed Packaging for Microsystems

Jacques Jacot, Frank Seigneur

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...

2006