Catégorie
Électromécanique
Publications associées (739)
Towards Scalable Electronics: Synthetic 2D Materials for Large-Area 2D Circuit Integration
In the past decades, a significant increase of the transistor density on a chip has led to exponential growth in computational power driven by Moore's law. To overcome the bottleneck of traditional von-Neumann architecture in computational efficiency, effo ...
EPFL2024Micromachining of Hafnium Carbide
During this project, the microfabrication of Hafnium Carbide (HfC) was investigated. Multiple tools were considered and tested for their compatibility and effectiveness when working with HfC. The main method of choice for the machining of HfC thin films wa ...
2023Etching selectivity and passivity of Al2O3 layers
The project focuses on etching properties of the atomic layer deposition (ALD) of Al2O3. For this purpose, etching processes such as plasma etch with sulfur hexafluoride (SF6), gas etch with xenon difluoride (XeF2), wet etch with MIF developer (726 MIF) as ...
2023First developments towards producing inductive magnetic sensors using state-of-the-art photolithography techniques
Duccio Testa, Ambrine Douhane, Marcus Cemes
Inductive magnetic sensors are needed for tokamak operation to provide the low-frequency (LF) measurements leading to the equilibrium reconstruction and to monitor the higher frequency (HF) instabilities; the HF magnetic sensors are often also used as a ba ...
2023Laser-Induced Forward Transfer of Functional Microdevices
Laser-induced forward transfer (LIFT) technique is an emerging micro additive manufacturing (AM) technique that has been widely used to print a variety of materials. Distinguished from other nozzle-based AM techniques, LIFT operates without the existence o ...
EPFL2023Annealing and Etching Processes for Hafnium Carbide MEMS
HfC has been very under-investigated due to its rarity and synthesising difficulty. Its potential for MEMS and NEMS applications has been recognized and is the object of an ongoing feasibility study for production since 2022. We continue on this impulse by ...
2023High density lithium niobate photonic integrated circuits
Tobias Kippenberg, Rui Ning Wang, Anat Siddharth, Mikhail Churaev, Nikolai Kuznetsov, Zihan Li, Junyin Zhang, Zelin Tan
Photonic integrated circuits have the potential to pervade into multiple applications traditionally limited to bulk optics. Of particular interest for new applications are ferroelectrics such as Lithium Niobate, which exhibit a large Pockels effect, but ar ...
NATURE PORTFOLIO2023Bringing casting to microfabrication: processing and deformation of microcastings
This work extends the range of pathways for the production of metallic microcomponents by downscaling metal casting. This is accomplished by using either of two different molding techniques, namely femtosecond laser micromachining or lithographic silicon m ...
EPFL2023Dynamic control of high-voltage actuator arrays by light-pattern projection on photoconductive switches
Herbert Shea, Amir Firouzeh, Edouard Franck Vincent Gustave Leroy, Vesna Bacheva, Aiste Balciunaite
The ability to control high-voltage actuator arrays relies, to date, on expensive microelectronic processes or on individual wiring of each actuator to a single off-chip high-voltage switch. Here we present an alternative approach that uses on-chip photoco ...
SPRINGERNATURE2023Analysis and Design for Medium Voltage Dual Active Bridge Converter Based on Series-Connected SiC MOSFETs
Chengmin Li, Rui Lu, Heng Fang
In this article, a series-connected SiC MOSFETs-based medium voltage (MV) dual active bridge (DAB) converter featuring a lowvoltage difference amongdevices and high efficiency is proposed. In the developed DAB converter, the zero voltage switching-on chara ...
Piscataway2023