Posez n’importe quelle question sur les cours, conférences, exercices, recherches, actualités, etc. de l’EPFL ou essayez les exemples de questions ci-dessous.
AVERTISSEMENT : Le chatbot Graph n'est pas programmé pour fournir des réponses explicites ou catégoriques à vos questions. Il transforme plutôt vos questions en demandes API qui sont distribuées aux différents services informatiques officiellement administrés par l'EPFL. Son but est uniquement de collecter et de recommander des références pertinentes à des contenus que vous pouvez explorer pour vous aider à répondre à vos questions.
Microsystem technologies (MST) have become the basis of a large industry. The advantages of MST compared to other technologies provide opportunities for application in implantable biomedical devices. This paper presents a general and broad literature revie ...
This thesis work aims to optimize the treatment of hydrocephalus. It consists of two distinct objectives: the optimization of the diagnosis of patients implanted with a shunt system for the derivation of cerebro-spinal fluid (CSF) and the optimization of t ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
Gas barrier coatings based on single or multiple layers of metals, oxides or nitrides are widely used on polymer substrates in applications ranging from food packaging to organic displays and solar cells. These coatings exhibit a residual permeability resu ...
A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...
Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
The invention relates to novel gas-barrier materials for food packaging, based on transparent nanosized hybrid organic/inorganic films on polymer substrates. By contrast with current brittle oxides, these new materials combine extremely high cohesive stren ...
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
Electrostatically driven MEMS devices commonly operate with electric fields as high at 108 V/m applied across the dielectric between electrodes. Even with the best mechanical design, the electrical design of these devices has a large impact both on perform ...
Institute of Electrical and Electronics Engineers2004
This paper describes Si-micromachined two-axis beam- steering micromirrors and their performance in 256 x 256- and 1024 x 1024-port large optical cross-connects (OXCs). The high-reflectivity wavelength-independent mirrors are electrostatically actuated; ca ...
