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The increasing ubiquity of edge devices in the consumer market, along with their ever more computationally expensive workloads, necessitate corresponding increases in computing power to support such workloads. In-memory computing is attractive in edge devi ...
3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The red ...
Ongoing changes in world demographics and the prevalence of unhealthy lifestyles are imposing a paradigm shift in healthcare delivery. Nowadays, chronic ailments such as cardiovascular diseases, hypertension and diabetes, represent the most common causes o ...
The recent advance of computer technology pushed the computing power of the modern computer systems to unprecedented levels; modern processors moved from the conventional, scalar type of architecture to more sophisticated, parallel ones, combining fast pro ...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
This article presents the design of a front-end circuit for monolithic active pixel sensors (MAPSs). The circuit operates with a sensor featuring a small, low-capacitance (