Concept

OMAP

Related publications (10)

A Compact Front-End Circuit for a Monolithic Sensor in a 65-nm CMOS Imaging Technology

This article presents the design of a front-end circuit for monolithic active pixel sensors (MAPSs). The circuit operates with a sensor featuring a small, low-capacitance (

Piscataway2023

Exploring brain-inspired multi-core heterogeneous hardware templates for low-power biomedical embedded systems

Benoît Walter Denkinger

The miniaturization of integrated circuits (ICs) and their higher performance and energy efficiency, combined with new machine learning algorithms and applications, have paved the way to intelligent, interconnected edge devices. In the medical domain, they ...

EPFL2023

BLADE: A BitLine Accelerator for Devices on the Edge

David Atienza Alonso, Marina Zapater Sancho, Alexandre Sébastien Julien Levisse, William Andrew Simon, Yasir Mahmood Qureshi

The increasing ubiquity of edge devices in the consumer market, along with their ever more computationally expensive workloads, necessitate corresponding increases in computing power to support such workloads. In-memory computing is attractive in edge devi ...

2019

Exploiting Compute Caches for Memory Bound Vector Operations

Paolo Ienne, Gabriel Falcao Paiva Fernandes, João Miguel Morgado Pereira Vieira

To reduce the average memory access time, most current processors make use of a multilevel cache subsystem. However, despite the proven benefits of such cache structures in the resulting throughput, conventional operations such as copy, simple maps and red ...

IEEE2018

Hardware/Software Co-Design of Ultra-Low Power Biomedical Monitors

Ruben Braojos Lopez

Ongoing changes in world demographics and the prevalence of unhealthy lifestyles are imposing a paradigm shift in healthcare delivery. Nowadays, chronic ailments such as cardiovascular diseases, hypertension and diabetes, represent the most common causes o ...

EPFL2016

Impact of Data Serialization over TSVs on Routing Congestion in 3D-Stacked Multi-Core Processors

Giovanni De Micheli, Yusuf Leblebici, Alessandro Cevrero, Giulia Beanato

3D integration can alleviate routing congestion, reducing the wirelength and improving performances. Nevertheless, each TSV still occupies non-negligible silicon area: as the number of TSV increases, their effect on the chip routing is detrimental. The red ...

Elsevier2016

Hardware Implementation and Applications of High Performance Multiple Camera Architectures

Kerem Seyid

Advancements in imaging technology made commercially available cameras cheaper, easily accessible with higher resolution than ever and with complex image capturing features. Today, it is estimated that more than one billion cameras sold every year. However ...

EPFL2016

Towards Multi-Fabric 3D Integration Architectures

Panagiotis Athanasopoulos

The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...

EPFL2012

3D-LIN: A Configurable Low-Latency Interconnect for Multi-Core Clusters with 3D Stacked L1 Memory

Giovanni De Micheli, Yusuf Leblebici, Luca Benini, Giulia Beanato

Shared L1 memories are of interest for tightly- coupled processor clusters in programmable accelerators as they provide a convenient shared memory abstraction while avoiding cache coherence overheads. The performance of a shared-L1 memory critically depend ...

2012

A flexible framework for efficient design of advanced 3D audio systems in multimedia applications

Aleksandar Simeonov

The recent advance of computer technology pushed the computing power of the modern computer systems to unprecedented levels; modern processors moved from the conventional, scalar type of architecture to more sophisticated, parallel ones, combining fast pro ...

EPFL2004

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