Radio-frequency engineering

Résumé

Radio-frequency (RF) engineering is a subset of electronic engineering involving the application of transmission line, waveguide, antenna and electromagnetic field principles to the design and application of devices that produce or use signals within the radio band, the frequency range of about 20 kHz up to 300 GHz. It is incorporated into almost everything that transmits or receives a radio wave, which includes, but is not limited to, mobile phones, radios, WiFi, and two-way radios. RF engineering is a highly specialized field that typically includes the following areas of expertise:

Design of antenna systems to provide radiative coverage of a specified geographical area by an electromagnetic field or to provide specified sensitivity to an electromagnetic field impinging on the antenna.

Design of coupling and transmission line structures to transport RF energy without radiation.

Application of circuit elements and transmission line structures in the design of oscillat

Source officielle

https://en.wikipedia.org/wiki/Radio-frequency_engineering

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The basic function of an IoT node is to collect data and send it through a wireless channel to the cloud. Since the power consumption of an IoT node is largely dominated by the wireless communication, it is therefore key to understand the trade-offs faced when designing the radio.

The main goal of this course is to give the student a solid introduction into approaches, methods, and instrumentation used in biomedical research. A major focus is on Magnetic Resonance Imaging (MRI) and related methods, but other imaging modalities will be increasingly covered.

The course covers the fundaments of bioelectronics and integrated microelectronics for biomedical and implantable systems. Issues and trade-offs at the circuit and systems levels of invasive microelectronic systems as well as their eluding designs, methods and classical implementations are discussed

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Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Benjamin Aaron Helfrecht, Alejandro Strachan

As the challenges in continued scaling of the integrated circuit technology escalate every generation, there is an urgent need to find viable solutions for both the front-end-of-line (transistors) and the back-end-of-line (interconnects). For the interconnect technology, it is crucial to replace the conventional barrier and liner with much thinner alternatives so that the current driving capability of the interconnects can be maintained or even improved. Due to the inherent atomically thin body thicknesses, 2D materials have recently been proposed and explored as Cu diffusion barrier alternatives. In this Perspective article, a variety of 2D materials that have been studied, ranging from graphene, h-BN, MoS2, WSe2 to TaS2, will be reviewed. Their potentials will be evaluated based on several criteria, including fundamental material properties as well as the feasibility for technology integration. Using TaS2 as an example, we demonstrate a large set of promising properties and point out that there remain challenges in the integration aspects with a few possible solutions waiting for validation. Applications of 2D materials for other functions in Cu interconnects and for different metal types will also be introduced, including electromigration, cobalt interconnects, and radio-frequency transmission lines.

AMER INST PHYSICS2020

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Design and development of sensing RFID Tags on flexible foil compatible with EPC Gen 2

Danick Briand, Nico de Rooij, Francisco Molina Lopez, Andres Felipe Vasquez Quintero

Taking advantage of the sensor interface capabilities of a radio frequency identification (RFID) chip, the integration of different types of sensors on printed ultrahigh frequency (UHF) RFID tags is investigated. The design, development, and testing of printed smart sensing tags compatible with the RFID standard electronic product code Gen 2 is presented. Two different strategies are employed to interface the sensors: 1) passive single-chip and 2) semipassive architectures. Both strategies provide sensor data by directly answering to the RFID reader inquiries or using a data logging mechanism to store the sensor data in the RFID chip memory. Temperature readout is measured using the embedded sensor in the RFID chip. Additionally, a light sensor and pressure sensor interfaced to a microcontroller are implemented in the passive and semipassive tags versions, respectively. For the employed RFID chip, two different UHF antennas are designed and printed using inkjet and screen printing to compare their radio frequency performances. Finally, the fabricated smart tags are fully validated through measurements in an anechoic chamber and their behaviors are compared with numerical simulation. The screen printed semipassive RFID tag with loop antenna shows a better reading range than the inkjet-printed one, whereas the passive tag can be considered as the most cost-effective system.

Institute of Electrical and Electronics Engineers2014

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Cost-effective dual-polarised leaky-wave antennas enabled by three-dimensional printing

Emile Jacques de Rijk, Tomislav Debogovic, Maria Garcia Vigueras, Esteban Menargues Gomez, Juan Ramon Mosig

This study proposes a compact dual-polarised directive radiator whose complex prototyping is enabled by additive manufacturing. In addition to monolithic implementation, stereolitography followed by metal coating, it also provides high radio-frequency performance, low cost and low weight. Dual-channel simultaneous operation is supported thanks to the integration of an orthomode transducer within the structure. Entirely waveguide based, this compound radiating structure is specially well suited to be 3D-printed, and in principle, it allows scaling to match a specific frequency of operation. Both the antenna concept and the employed advanced manufacturing technique are validated experimentally through the realisation and measurement of two prototypes operating, respectively, at 30 and 60 GHz. The proposed architecture is easily amenable to be grouped in a compact higher-gain array, thus holding strong potential for platform-constrained applications, such as inter-satellite links between CubeSats.

Inst Engineering Technology-Iet2017

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