Concept

Liaison ionique

Publications associées (433)

Influence of geometric, strain and size effects on bond in structural concrete

Design formulations for calculation of bond strength in structural concrete members usually include a number of parameters such as the stress acting in the reinforcement, the concrete cover and the diameter of the reinforcing bars. These parameters are act ...

Bond in Concrete 20122012

CW laser induced crystallization of thin amorphous silicon films deposited by EBE and PECVD

Cyril Cayron

This work presents the Continuous Wave (CW) laser crystallization of thin amorphous silicon (a-Si) films deposited by Plasma Enhanced Chemical Vapor Deposition (PECVD) and by Electron Beam Evaporation (EBE) on low cost glass substrate. The films are charac ...

2012

Persistence of singlet fluctuations in the coupled spin tetrahedra system Cu2Te2O5Br2 revealed by high-field magnetization, Br-79 NQR, and Te-125 NMR

Helmuth Berger

We present high-field magnetization and Br-79 nuclear quadrupole resonance (NQR) and Te-125 nuclear magnetic resonance (NMR) studies in the weakly coupled Cu2+ (S = 1/2) tetrahedral system Cu2Te2O5Br2. The field-induced level crossing effects were observed ...

Amer Physical Soc2012

Simplex solids in SU(N) Heisenberg models on the kagome and checkerboard lattices

Frédéric Mila, Karlo Penc

We present a numerical study of the SU(N) Heisenberg model with the fundamental representation at each site for the kagome lattice (for N = 3) and the checkerboard lattice (for N = 4), which are the line graphs of the honeycomb and square lattices and thus ...

2012

Ionic liquids as matrices in microfluidic sample deposition for high-mass matrix-assisted laser desorption/ionization mass spectrometry

Henning Paul-Julius Stahlberg

Sample preparation for matrix-assisted laser desorption/ionization mass spectrometry (MALDI-MS) via a microfluidic deposition device using ionic liquid matrices addresses several problems of standard protocols with crystalline matrices, such as the heterog ...

IM Publications2012

Electronic, vibrational, and transport properties of pnictogen-substituted ternary skutterudites

Nicola Marzari, Boris Kozinsky

First principles calculations are used to investigate electronic band structure and vibrational spectra of pnictogen-substituted ternary skutterudites. We compare the results with the prototypical binary composition CoSb3 to identify the effects of substit ...

2012

Thiol-Ene Click Chemistry as a Tool for a Novel Family of Polymeric Ionic Liquids

Jutta Christine Wandrey

Functionalized pyrrolidinium compounds, 3-((2-hydroxyethylthio)methyl)-1,1,4-trimethylpyrrolidinium and 3-((2-carboxyethylthio)methyl)-1,1,4-trimethylpyrrolidinium chlorides, are prepared from N,N-diallyl-N,N-dimethylammonium chloride by radical thiol-ene ...

2012

Evaluation of ionic liquid soluble imidazolium tetrachloropalladate pre-catalysts in Suzuki coupling reactions

Paul Joseph Dyson, Rosario Scopelliti, Zhaofu Fei, Ning Yan, Xiang Li, Kelly Joan Kilpin, Hongbing Song

Imidazolium salts with aromatic groups 1,3-bis(9-anthracenylmethyl)imidazolium chloride ([Bamim]Cl), 1,3-bis(1-naphthalenylmethyl)imidazolium chloride ([Bnmim]Cl) and 1,3-bis( benzylmethyl)imidazolium chloride ([Bbmim]Cl) were reacted with PdCl2 forming th ...

Elsevier2012

Volatilities of Actinide and Lanthanide N,N-Dimethylaminodiboranate Chemical Vapor Deposition Precursors: A DFT Study

N,N-Dimethylaminodiboranate complexes with praseodymium, samarium, erbium, and uranium, which are potential chemical vapor deposition precursors for the deposition of metal boride and oxide thin films, have been investigated by DFT guided by field-ionizati ...

Amer Chemical Soc2012

Low temperature pyrex/silicon wafer bonding via a single intermediate parylene layer

Martinus Gijs, Ata Tuna Ciftlik

We introduce a new low temperature (280 °C) parylene-C wafer bonding technique, where parylene-C bonds directly a Pyrex wafer to a silicon wafer with either a Si, SiO2 or Si3N4 surface with a bonding strength up to 23 MPa. The technique uses a single layer ...

IEEE2011

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