Publications associées à STMicroelectronics

Integration of MEMS in Silicon Photonics

Like integrated electronics, integrated photonics such as Silicon Photonics benefit from increased device-density on a single chip. Silicon is an excellent material for integrated photonics because its high refractive index allows devices to be made small, ...

EPFL2021

Cryogenic Fab-on-a-Chip Sticks the Landing

Matthias Imboden, Han Han

Using a microelectromechanical systems (MEMS)-based Fab-on-a-Chip, we quench-condense lead thin-films. Suppressing the formation of lead islands makes it possible to grow a homogeneous and continuous film as thin as 2 nm, without the use of an adhesion lay ...

Amer Chemical Soc2017

Efficient, compact and low loss thermo-optic phase shifter in silicon

Christophe Marcel Georges Galland

We design a resistive heater optimized for efficient and low-loss optical phase modulation in a silicon-on-insulator (SOI) waveguide and characterize the fabricated devices. Modulation is achieved by flowing current perpendicular to a new ridge waveguide g ...

Optical Soc Amer2014

Design Methodologies and CAD for Emerging Nanotechnologies

Shashi Kanth Bobba

With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...

EPFL2013

A 2.78 mm2 65 nm CMOS Gigabit MIMO Iterative Detection and Decoding Receiver

Andreas Peter Burg

Iterative detection and decoding (IDD), combined with spatial-multiplexing multiple-input multiple-output (MIMO) transmission, is a key technique to improve spectral efﬁciency in wireless communications. In this paper we present the—to the best of our know ...

2012

100 mm dynamic stencils pattern sub-micrometre structures

Jürgen Brugger, Andreea Veronica Savu, Shenqi Xie

Dynamic stencil lithography uses a moving shadow-mask to draw patterns by having directionally evaporated material deposited through the stencil apertures onto the substrate. Sub-micrometre, two- dimensional patterning is demonstrated at full 100 mm wafer ...

2011

Power-scalable 1.57µm mode-locked semiconductor disk laser using wafer fusion

Elyahou Kapon, Alexandru Mereuta, Alexei Sirbu, Andrei Caliman

We report the first (to our knowledge) wafer-fused high-power passively mode-locked semiconductor disk laser operating at 1.57 mu m wavelength. An InP-based active medium was fused with GaAs/AlGaAs distributed Bragg reflector on a 2 inch wafer level, resul ...

2009

Capacités variables et inductances MEMS RF pour une intégration "Above-IC"

Alexander Mehdaoui

This work was carried out in a collaborative framework between Ecole Polytechnique Fédérale de Lausanne and an industrial partner ST Microelectronics. RF MEMS passives are key devices for the RF front-end in modern transceiver and receiver architectures, o ...

EPFL2007

An Epoxy Photoresist Modified by Luminescent Nanocrystals for the Fabrication of 3D High-Aspect-Ratio Microstructures

Jürgen Brugger, Vahid Fakhfouri

An epoxy-based negative-tone photoresist, which is known as a suitable material for high-aspect-ratio surface micromachining, is functionalized with red-light-emitting CdSe@ZnS nanocrystals (NCs). The proper selection of a common solvent for the NCs and th ...

2007

Full wafer integration of NEMS on CMOS by nanostencil lithography

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart

Wafer scale nanostencil lithography is used to define 200 nm scale mechanically resonating silicon cantilevers monolithically integrated into CMOS circuits. We demonstrate the simultaneous patterning of ~2000 nanodevices by post-processing standard CMOS wa ...

2006