Concept

Solderability

Publications associées (10)

Dynamic wetting in pressure-infiltration of ceramic particle preforms by molten metal

This thesis investigates the interaction between mechanically induced flow of a liquid metal into a porous solid, and kinetic effects at the triple line. The approach is experimental and focuses on metal-ceramic systems for which the literature gives value ...

EPFL2019

Overcritical Current Resistivity of YBCO-Coated Conductors Through Combination of PCM and Finite-Element Analysis

Francesco Grilli, Nicolo' Riva, Bertrand Dutoit

Understanding the electro-thermal behavior of high-temperature superconductor (HTS) materials is a critical aspect for designing efficient and reliable applications. In order to optimize cost and performance, one needs to understand the role played by the ...

2019

Influence of temperature and wetting angle on capillarity in pressure infiltration

Andreas Mortensen, William Craig Carter, Ludger Weber, Alain Léger, Gionata Schneider

Capillary forces in the pressure infiltration process can be quantified by measuring saturation curves; these are plots of the fraction pore space filled with the liquid infiltrant versus the pressure difference between the liquid and the atmosphere initia ...

2015

Assainissement de la décharge de Colliare à Penthaz – Etude de variantes

Gabrielle Hack

The landfill of Colliare is situated on the left bank of the river « la Venoge », at the place of a former gravel pit in the municipality of Penthaz. It was exploited until 1995 and many different wastes were deposited in it, such as incineration slag of h ...

2011

Correlation of microstructural and mechanical properties in particle reinforced lead-free solders

Venkatesh Sivasubramaniam

Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...

EPFL2009

Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...

Springer US2008

Reliability Analysis of Lead-free Solders

John Botsis, Joël Cugnoni

In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...

Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008

Experimental and numerical studies on size and constraining effects in lead-free solder joints

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

Search String Advanced > Saved Searches > ARTICLE TOOLS Get PDF (641K) Save to My Profile E-mail Link to this Article Export Citation for this Article Get Citation Alerts Request Permissions More Sharing ServicesShare | Share on citeuli ...

2007

Wetting in infiltration of alumina particle preforms with molten copper

Andreas Mortensen, Ludger Weber, Maryam Bahraini Hasani

The high-temperature wettability of alumina particulate preforms by copper is investigated by means of infiltration experiments conducted at 1473 K under low oxygen partial pressure. Wetting is quantified in terms of drainage curves, which plot the volume ...

Kluwer Academic Publishers, Springer2005

Diffusion-limited reactive wetting: Spreading of Cu-Sn-Ti alloys on vitreous carbon

Andreas Mortensen

When wetting is promoted by interfaces, the rate at which the liquid spreads over the solid substrate is controlled by the rate at which the well-wetted interfacial product can be formed along the liquid/solid/atmospheric triple line. If this reaction invo ...

2001

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