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The effects of particle reinforcement of Sn-4.0wt.%Ag-0.5wt.%Cu (SAC405) lead-free solder on interfacial intermetallic layer growth and strength of the ensuing joints through short-term isothermal aging (150 degrees C) were studied. Composite solders were ...
When wetting is promoted by interfaces, the rate at which the liquid spreads over the solid substrate is controlled by the rate at which the well-wetted interfacial product can be formed along the liquid/solid/atmospheric triple line. If this reaction invo ...
The high-temperature wettability of alumina particulate preforms by copper is investigated by means of infiltration experiments conducted at 1473 K under low oxygen partial pressure. Wetting is quantified in terms of drainage curves, which plot the volume ...
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
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Capillary forces in the pressure infiltration process can be quantified by measuring saturation curves; these are plots of the fraction pore space filled with the liquid infiltrant versus the pressure difference between the liquid and the atmosphere initia ...
In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...
Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008