Publications associées à Hermetic seal

Nanoliter Liquid Packaging in a Bioresorbable Microsystem by Additive Manufacturing and its Application as a Controlled Drug Delivery Device

Jürgen Brugger, Arnaud Bertsch, Cristina Martin Olmos, Jongeon Park

Precise packaging of nanoliter amounts of liquid in a microsystem is important for many biomedical applications. However, existing liquid encapsulation technologies have limitations in terms of liquid waste, evaporation, trapped bubbles, and liquid degrada ...

2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon, Thierry Hessler

Au-In bonds with a nominal composition of about 60 at.% In were fabricated for use in wafer-level packaging of MEMS. The microstructure of the bonds was studied by scanning electron microscopy. The bond hermeticity was then assessed using oxidation of Cu t ...

Institute of Physics2015

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

Nico de Rooij, Danick Briand, Yves Pétremand

This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...

Institute of Physics2013

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Nico de Rooij, Danick Briand, Terunobu Akiyama, Rokhaya Gueye

A System-in-Package (SiP) concept for the 3D-integration of a Single Wall Carbon Nanotube (SWCNT) resonator with its CMOS driving electronics is presented. The key element of this advanced SiP is the monolithic 3D-integration of the MEMS with the CMOS elec ...

SPIE - International Society of Optical Engineering2013

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Paul Muralt, Thomas Maeder, Bo Jiang

Micro solid oxide fuel cells (μ-SOFCs) based on MEMS fabrication processes have become an increasingly attractive option for portable power generation applications, due to their high power density and their compatibility with hydrocarbon fuels. For system ...

IMAPS / ACerS2012

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Flip chip bonding technologies for hybrid integration

Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...

Institut de Microtechnique, Université de Neuchâtel2009

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Hermetic seal

Nanoliter Liquid Packaging in a Bioresorbable Microsystem by Additive Manufacturing and its Application as a Controlled Drug Delivery Device

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

FRP sandwich structures in bridge and building construction

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Hermetic package for optical MEMS

Flip chip bonding technologies for hybrid integration

Graph Chatbot

Chattez avec Graph Search

Solid-liquid interdiffusion (SLID) bonding in the Au-In system: experimental study and 1D modelling

FRP sandwich structures in bridge and building construction

High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS

Low-temperature thin-film indium bonding for reliable wafer-level hermetic MEMS packaging

An evaluation of thick-film silver die-attach as micro solid oxide fuel cells (μ-SOFCs) interconnection packaging

Encapsulation hermétique pour systèmes hydro- et thermo-sensibles

Hermetic package for optical MEMS

Flip chip bonding technologies for hybrid integration

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS