Laser ablation or photoablation (also called laser blasting) is the process of removing material from a solid (or occasionally liquid) surface by irradiating it with a laser beam. At low laser flux, the material is heated by the absorbed laser energy and evaporates or sublimates. At high laser flux, the material is typically converted to a plasma. Usually, laser ablation refers to removing material with a pulsed laser, but it is possible to ablate material with a continuous wave laser beam if the laser intensity is high enough. While relatively long laser pulses (e.g. nanosecond pulses) can heat and thermally alter or damage the processed material, ultrashort laser pulses (e.g. femtoseconds) cause only minimal material damage during processing due to the ultrashort light-matter interaction and are therefore also suitable for micromaterial processing.
Excimer lasers of deep ultra-violet light are mainly used in photoablation; the wavelength of laser used in photoablation is approximately 200 nm.
The depth over which the laser energy is absorbed, and thus the amount of material removed by a single laser pulse, depends on the material's optical properties and the laser wavelength and pulse length. The total mass ablated from the target per laser pulse is usually referred to as ablation rate. Such features of laser radiation as laser beam scanning velocity and the covering of scanning lines can significantly influence the ablation process.
Laser pulses can vary over a very wide range of duration (milliseconds to femtoseconds) and fluxes, and can be precisely controlled. This makes laser ablation very valuable for both research and industrial applications.
The simplest application of laser ablation is to remove material from a solid surface in a controlled fashion. Laser machining and particularly laser drilling are examples; pulsed lasers can drill extremely small, deep holes through very hard materials. Very short laser pulses remove material so quickly that the surrounding material absorbs very little heat, so laser drilling can be done on delicate or heat-sensitive materials, including tooth enamel (laser dentistry).
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The physical principles of laser light materials interactions are introduced with a large number of industrial application examples. Materials processing lasers are developing further and further, the
Repeatability in laser material processing is challenging due to high-speed dynamics. To address this issue, the course provides an overview of laser theory, laser-material interaction, various types
Provide understanding of the optical properties of materials, principles of laser operation and properties of generated light. Comprehension of basics of interaction between laser light and materials
Laser engraving is the practice of using lasers to engrave an object. Laser marking, on the other hand, is a broader category of methods to leave marks on an object, which in some cases, also includes color change due to chemical/molecular alteration, charring, foaming, melting, ablation, and more. The technique does not involve the use of inks, nor does it involve tool bits which contact the engraving surface and wear out, giving it an advantage over alternative engraving or marking technologies where inks or bit heads have to be replaced regularly.
Ablation (ablatio – removal) is the removal or destruction of something from an object by vaporization, chipping, erosive processes, or by other means. Examples of ablative materials are described below, including spacecraft material for ascent and atmospheric reentry, ice and snow in glaciology, biological tissues in medicine and passive fire protection materials. In artificial intelligence (AI), especially machine learning, ablation is the removal of a component of an AI system.
thumb|Machine de découpe laser en train de couper des formes géométriques sur du polystyrène expansé. thumb|Machine de découpe laser à l'exposition "". La découpe laser est un procédé de fabrication qui consiste à découper la matière grâce à une grande quantité d’énergie générée par un laser et concentrée sur une très faible surface. Cette technologie est majoritairement destinée aux chaînes de production industrielles, mais peut également convenir aux boutiques, aux établissements professionnels et aux tiers-lieux de fabrication.
Learn the basics of plasma, one of the fundamental states of matter, and the different types of models used to describe it, including fluid and kinetic.
Learn the basics of plasma, one of the fundamental states of matter, and the different types of models used to describe it, including fluid and kinetic.
Explore les applications d'ablation laser, les lasers excimer et leurs diverses utilisations dans la production microélectronique et le prototypage rapide.
Explore les techniques d'ablation laser, de flexion et de soudage, y compris les principes de l'ablation laser et l'application de différents types de lasers dans le traitement des matériaux.
Couvre les applications de micro-usinage laser, l'interaction laser-matière, les concepts de photons, les faisceaux gaussiens et les processus laser femtoseconde.
Ultrashort laser pulses, i.e., pulses emitted shorter than a picosecond, can tailor material properties by introducing permanent modifications locally in three dimensions. Remarkably, under a certain exposure condition, these modifications are accompanied ...
EPFL2023
Over the last decades, the progress made in the generation of laser pulses shorter than a picosecond (10^-12 s) has allowed us to reach extreme optical power intensities exceeding 10^15 W cm^-2. This tremendous power has triggered an abundance of original ...
The formation of elemental trigonal tellurium (t-Te) on tellurite glass surfaces exposed to femtosecond laser pulses is discussed. Specifically, the underlying elemental crystallization phenomenon is investigated by altering laser parameters in common tell ...