Concept

Cupronickel

Publications associées (37)

Dislocation Hardening in a New Manufacturing Route of Ferritic Oxide Dispersion-Strengthened Fe-14Cr Cladding Tube

The microstructure evolution associated with the cold forming sequence of an Fe-14Cr-1W-0.3Ti-0.3Y2O3 grade ferritic stainless steel strengthened by dispersion of nano oxides (ODS) was investigated. The material, initially hot extruded at 1100 degrees C an ...

MDPI2024

Micro-addition of Fe in highly alloyed Cu-Ti alloys to improve both formability and strength

Roland Logé, Cyril Cayron, Baptiste Thomas Jean Rouxel

Cu-Be alloys provide excellent electrical and mechanical properties, but present serious health hazards during manufacturing. Among alternative alloys, the Cu-Ti system has the highest yield strength; however, Ti cannot be easily solutionized at concentrat ...

ELSEVIER SCI LTD2022

In situ growth of graphene on both sides of a Cu-Ni alloy electrode for perovskite solar cells with improved stability

Michael Graetzel, Yinghui Wu, Huimin Su

The instability of rear electrodes undermines the long-term operational durability of efficient perovskite solar cells. Here, a composite electrode of copper-nickel (Cu-Ni) alloy stabilized by in situ grown bifacial graphene is designed. The alloying makes ...

NATURE PORTFOLIO2022

Template-assisted electrodeposition of nickel and nickel copper 3D microcomponents

Patrik Schürch

New types of metamaterials and architectured material require metallic materials with precise structural design in the microscale. However, additivemanufacturing of metallic structures in themicroscale has proven difficult, as the demand for the material q ...

EPFL2020

A Study on the Characteristics of Cu-Mn-Dy Alloy Resistive Thin Films

Ho-Yun Lee

Cu-Mn-Dy resistive thin films were prepared on glass and Al2O3 substrates, which was achieved by co-sputtering the Cu-Mn alloy and dysprosium targets. The effects of the addition of dysprosium on the electrical properties and microstructures of annealed Cu ...

2019

Ductility reduction factor formulations for seismic design of RC wall and frame structures

Katrin Beyer, Matteo Zerbin

Seismic design of standard structures is typically founded on a force-based design approach. Over the years this approach has proven robust and easily applicable by design engineers and - in combination with capacity design principles - it provides a good ...

ELSEVIER SCI LTD2019

Dislocation cross-slip in fcc solid solution alloys

William Curtin, Wolfram Georg Nöhring

Cross-slip is a fundamental process of screw dislocation motion and plays an important role in the evolution of work hardening and dislocation structuring in metals. Cross-slip has been widely studied in pure FCC metals but rarely in FCC solid solutions. H ...

2017

Metallization of Si heterojunction solar cells by nanosecond laser ablation and Ni-Cu plating

Christophe Ballif, Aïcha Hessler-Wyser, Bertrand Yves Paul Paviet-Salomon, Jan-Willem Alexander Schüttauf, Matthieu Despeisse, Monica Morales Masis, Ali Dabirian

A key step in industrialization of photovoltaics (PV) is the development of low-cost and large-area metallization processes to substitute the standard screen-printing process of silver paste. Thus Cu and Ni metallization processes enabled by laser patterni ...

Elsevier2017

Influence of icosahedral short range order on diffusion in liquids: A study on Al-Zn-Cr alloys

Michel Rappaz, Güven Kurtuldu

It has been shown recently that minute additions of Cr in Al-Zn alloys refine the solidified grain structure and induce multiply-twinned grains which can only be explained if the icosahedral symmetry is considered (Kurtuldu et al., 2013). It has been sugge ...

Elsevier2016

Porous thick-film silver metallisation for thermally mismatched brazing operations in tokamak magnetic sensor

Duccio Testa, Peter Ryser, Lucas Güniat, Thomas Maeder, Caroline Jacq, Adrien Aymeric Thibault Corne

A novel sensor based on thick-film + LTCC (low-temperature cofired ceramic) technology has been recently developed for sensing high-frequency 3D magnetic fields in tokamak fusion devices. For integration within the walls of the tokamak, the sensor has to b ...

IMAPS / ACerS2015

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