Reconfigurable platforms are a promising technology that offers an interesting trade-off between flexibility and performance, which many recent embedded system applications demand, especially in fields such as multimedia processing. These applications typi ...
In this work, a chip-level post-CMOS processing protocol for 3D integration is presented to achieve multilayer stacking. This protocol includes TSV formation on the top chip, bonding the chips on top of each other, and finally the electrical connection pro ...
The fabrication of a slot waveguide cavity oriented to sensing application is demonstrated. The choice of materials and the development of the process flow steps, including E-beam lithography (EBL) and metal lift-off of a single thin layer, are illustrated ...
In jewelry manufacturing, joining dissimilar materials is usually achieved by soldering or brazing, but these techniques have several disadvantages as compared for example with laser welding. In this last case, however, it is necessary to have a thorough u ...
Minerals, Metals & Materials Soc, 184 Thorn Hill Rd, Warrendale, Pa 15086-7514 Usa2009
We present the phase diagram of the frustrated ferromagnetic S=1/2 Heisenberg J(1)-J(2) chain in a magnetic field, obtained by large scale exact diagonalizations and density matrix renormalization group simulations. A vector chirally ordered state, metamag ...
The pulp and paper (P&P) industry in industrially mature countries is facing a long-term crisis. Large and modern manufacturing facilities in tropical regions emerge as new competitors. The constant increase of energy costs has also contributed to the fina ...
