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The dissertation “Archaeological area of Classe: memory and identity of a buried place” introduces a strategic and global masterplan to set a new dialogue between the ancient traces of the Ravenna’s harbour and the system of fascinating Early Christian bas ...
We study the behaviour of extremal eigenvalues of the Dirichlet biharmonic operator over rectangles with a given fixed area. We begin by proving that the principal eigenvalue is minimal for a rectangle for which the ratio between the longest and the shorte ...
We study a natural generalization of the problem of minimizing makespan on unrelated machines in which jobs may be split into parts. The different parts of a job can be (simultaneously) processed on different machines, but each part requires a setup time b ...
It is an old problem of Danzer and Rogers to decide whether it is possible arrange O(1/epsilon) points in the unit square so that every rectangle of area epsilon contains at least one of them. We show that the answer to this question is in the negative if ...
We prove a conditional theorem on the positivity of the Lyapunov exponent for a Schrödinger cocycle over a skew shift base with a cosine potential and the golden ratio as frequency. For coupling below 1, which is the threshold for Herman's subharmonicity t ...
The draw resonance effect appears in fiber spinning processes if the ratio of take-up to inlet velocity, the so-called draw ratio, exceeds a critical value and manifests itself in steady oscillations of flow velocity and fiber diameter. We study the effect ...
Fiber-based devices with advanced functionalities are emerging as promising solutions for various applications in flexible electronics and bioengineering. Multimaterial thermal drawing, in particular, has attracted strong interest for its ability to genera ...
A natural extension of the makespan minimization problem on unrelated machines is to allow jobs to be partially processed by different machines while incurring an arbitrary setup time. In this paper we present increasingly stronger LP-relaxations for this ...
Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...
Semiconductor nanowires are an emerging class of nanostructures that represent attractive building blocks for nanoscale electronic and photonic devices. To the present, nanowires are synthesized on a small scale by experimentally demanding gas phase deposi ...
