Publications associées à Câblage par fil

Assembling of Thick PZT Sheet on Silicon for Energy Harvesting Applications

Nico de Rooij, Danick Briand, Jinyu Jason Ruan, Pattanaphong Janphuang, Robert Andrew Lockhart, Don Isarakorn

Bulk PZT ceramics provide high electromechanical coupling (k) which is desirable for piezoelectric energy harvesters since the energy transformed from a mechanical agitation into an electrical output is proportional to k2 [1-2]. However, piezoelectric cant ...

2011

Nanostructured surface fabricated by laser interference lithography to attenuate the reflectivity of microlens arrays

Hans Peter Herzig, Toralf Scharf, Pierre-Yves Baroni

A subwavelength-scale square lattice optical nanostructure is fabricated using an interference photolithography process on the surface of a quartz microlens array. This nanostructuring of the quartz surface introduces an antireflective effect, reducing ref ...

2010

Low Temperature Indium-based Sealing of Microfabricated Alkali Cells for Chip Scale Atomic Clocks

Nico de Rooij, Yves Pétremand, Rahel Strässle

In this paper, the development of a low temperature bonding process focused on indium-based technology for microfabricated alkali cells is presented. The intended application is the use of these cells in chip scale atomic clocks. The existing technology is ...

2010

Design and fabrication technology for high performance electrical pumped terahertz photonic crystal band edge lasers with complete photonic band gap

Romuald Houdré, Hua Zhang, Jérôme Faist

We detail the design and fabrication technology of two-dimensional photonic crystal (PhC) band edge emitting quantum cascade lasers (QCLs) operating at terahertz frequencies (similar to 3.3 THz). The entire QCL active layer has been deeply etched to form a ...

2010

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally low t ...

2009

Flip chip bonding technologies for hybrid integration

Hybrid integration and especially the packaging of microelectromechanical systems (i.e. MEMS) cannot rely on standardised packaging solutions due to the diversity of microsystems. As an example, the packaging requirements of a pressure sensor are different ...

Institut de Microtechnique, Université de Neuchâtel2009

Semiconductor device and method of manufacturing a semiconductor device

Mihai Adrian Ionescu, Didier Bouvet, Kirsten Emilie Moselund

The local bending of a silicon nanowire induces tensile strain in the wire due to the stretching of the silicon lattice. This in turn enhances the mobility of the free carriers (electrons) in the direction of transport along the wire. Thus, for example, wh ...

2009

Hermetic package for optical MEMS

Peter Ryser, Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

2008

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Câblage par fil

Assembling of Thick PZT Sheet on Silicon for Energy Harvesting Applications

Nanostructured surface fabricated by laser interference lithography to attenuate the reflectivity of microlens arrays

Low Temperature Indium-based Sealing of Microfabricated Alkali Cells for Chip Scale Atomic Clocks

Design and fabrication technology for high performance electrical pumped terahertz photonic crystal band edge lasers with complete photonic band gap

Hermetic package for optical MEMS

Flip chip bonding technologies for hybrid integration

Semiconductor device and method of manufacturing a semiconductor device

Hermetic package for optical MEMS

Prediction of the adhesive fillet size for skin to honeycomb core bonding in ultra-light sandwich structures

Examination of Be//Cu joints in hipped Be tiles by using Ion Beam Analysis methods

Graph Chatbot

Chattez avec Graph Search

Flip chip bonding technologies for hybrid integration

Design and fabrication technology for high performance electrical pumped terahertz photonic crystal band edge lasers with complete photonic band gap

Semiconductor device and method of manufacturing a semiconductor device

Prediction of the adhesive fillet size for skin to honeycomb core bonding in ultra-light sandwich structures

Assembling of Thick PZT Sheet on Silicon for Energy Harvesting Applications

Nanostructured surface fabricated by laser interference lithography to attenuate the reflectivity of microlens arrays

Low Temperature Indium-based Sealing of Microfabricated Alkali Cells for Chip Scale Atomic Clocks

Hermetic package for optical MEMS

Hermetic package for optical MEMS

Examination of Be//Cu joints in hipped Be tiles by using Ion Beam Analysis methods