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Publications associées (68)

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Nanoscale spatially resolved infrared spectra from single microdroplets

Giovanni Dietler, Andrzej Kulik, Francesco Simone Ruggeri

Droplet microfluidics has emerged as a powerful platform allowing a large number of individual reactions to be carried out in spatially distinct microcompartments. Due to their small size, however, the spectroscopic characterisation of species encapsulated ...

Royal Society of Chemistry2014

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Low temperature processing of Dye-sensitized Solar Cells (DSCs) is essential to enable commercialization with low cost plastic substrates and diminish the overall manufacturing cost. We report a low temperature processing route for photoanodes where thin Z ...

Elsevier Science Bv2014

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Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Growing demands for increased functionality in consumer electronics and for information technology-enabled services in various sectors have resulted in the rise of high-performance multiprocessor system-on-chips (MPSoCs) and three-dimensionally stacked int ...

EPFL2013

A Passive Louver-Based Daylighting System

Marilyne Andersen

A daylighting system for use in a building including a louver array having a first longitudinal element, and a second longitudinal element spaced therefrom. At least one of the first and second elements has an asymmetrical profile, each of the first and se ...

United States Patent and Trademark Office (USPTO)2013

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The successful experimental demonstration of large-scale and in-situ growth of horizontal, dense and aligned carbon nanotube (CNT) arrays is presented. This new CNT growth process is developed for the direct integration of nanotubes into gas sensing device ...

2013

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

The continuing trend in the automotive and aviation industries to reduce complexity of electronic systems by removing cooling results in a need for high temperature electronics and associated packaging technologies. To ensure reliability over long periods ...

IMAPS / ACerS2012

Fabrication and characterization of wafer-level deep TSV arrays

Michail Zervas, Yusuf Leblebici, Yüksel Temiz

Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are commonly categorized according to their aspect ratio and diameter. An equally important parameter ...

IEEE2012

Reflow Of Non-Circular Nano-Pillars To Fabricate Nano-Scale Solid Immersion Lenses

Hans Peter Herzig, Toralf Scharf, Myun Sik Kim

We investigate the reflow of non-circular, i.e., triangular and square, shaped pillars to fabricate nano-scale solid immersion lenses (SILs). Electron beam lithography (EBL) and thermal reflow are the core of the fabrication process. For the optical charac ...

Ieee2012

Alternative Search Techniques for Face Detection Using Location Estimation and Binary Features

Venkatesh Bala Subburaman

The sliding window approach is the most widely used technique to detect objects from an image. In the past few years, classifiers have been improved in many ways to increase the scanning speed. Apart from the classifier design (such as the cascade), the sc ...

EPFL2012