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Publications associées (68)

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T0004 / Soldering wires to sensor contact pads

Thomas Maeder

The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...

EPFL2008

0-level Vacuum Packaging RT Process for MEMS Resonators

Mihai Adrian Ionescu, Cyrille Hibert, Daniel Grogg, Nicolas Abelé

A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...

2008

MOEMS thermal imaging camera

Muhammed Fatih Toy, Onur Ferhanoglu

A novel thermo-mechanical Infrared (IR) imaging array with integrated diffraction gratings for optical readout was fabricated and tested. Parylene was used as a structural material for its low thermal conductivity and high thermal expansion properties. Tes ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2008

Microsystem technologies for implantable applications

Nico de Rooij

Microsystem technologies (MST) have become the basis of a large industry. The advantages of MST compared to other technologies provide opportunities for application in implantable biomedical devices. This paper presents a general and broad literature revie ...

2007

Light structuring for massively parallel optical trapping

Johann Rohner

Optical trapping, discovered in the 70's, allows moving and stabilizing small objects which sizes varies from atoms to particles of several microns. This technique, based on momentum conservation, is particularly well suited for manipulating biological mat ...

EPFL2007

Thermal-mechanical detector array with integrated diffraction grating

Onur Ferhanoglu

An uncooled thermal detector array with low NETD is designed and fabricated using MEMS bimaterial structures. A diffraction grating is embedded on the pixel membrane for sensing sub-nm mechanical deflections. The first order reflected light was focused on ...

Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2007

A Single Photon Avalanche Diode Array Fabricated in 0.35um CMOS and based on an Event-Driven Readout for TCSPC Experiments

Edoardo Charbon, Cristiano Niclass

The design and characterization of an imaging sensor based on single photon avalanche diodes is presented. The sensor was fully integrated in a 0.35µm CMOS technology. The core of the imager is an array of 4x112 pixels that independently and simultaneously ...

2006

Laser soldered packaging hermeticity measurement using metallic conductor resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...

2006

Tunable optofluidic distributed feedback dye lasers

Demetri Psaltis

We demonstrated a continuously tunable optofluidic distributed feedback (DFB) dye laser on a monolithic poly(dimethylsiloxane) (PDMS) elastomer chip. The optical feedback was provided by a phase-shifted higher order Bragg grating embedded in the liquid cor ...

2006

Laser Soldered Packaging Hermeticity Measurement Using Metallic Conductor Resistance

Jacques Jacot, Thomas Maeder, Frank Seigneur

Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...

2006