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The tedious and expensive process of attaching SIL contacts to the sensor edges may be advantageously replaced by soldering wires and cables directly to the sensor contact pads. However, this process is a bit more critical, as applying excessive heat can d ...
A novel thermo-mechanical Infrared (IR) imaging array with integrated diffraction gratings for optical readout was fabricated and tested. Parylene was used as a structural material for its low thermal conductivity and high thermal expansion properties. Tes ...
Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2008
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...
Microsystem technologies (MST) have become the basis of a large industry. The advantages of MST compared to other technologies provide opportunities for application in implantable biomedical devices. This paper presents a general and broad literature revie ...
An uncooled thermal detector array with low NETD is designed and fabricated using MEMS bimaterial structures. A diffraction grating is embedded on the pixel membrane for sensing sub-nm mechanical deflections. The first order reflected light was focused on ...
Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa2007
Optical trapping, discovered in the 70's, allows moving and stabilizing small objects which sizes varies from atoms to particles of several microns. This technique, based on momentum conservation, is particularly well suited for manipulating biological mat ...
We demonstrated a continuously tunable optofluidic distributed feedback (DFB) dye laser on a monolithic poly(dimethylsiloxane) (PDMS) elastomer chip. The optical feedback was provided by a phase-shifted higher order Bragg grating embedded in the liquid cor ...
Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
The design and characterization of an imaging sensor based on single photon avalanche diodes is presented. The sensor was fully integrated in a 0.35µm CMOS technology. The core of the imager is an array of 4x112 pixels that independently and simultaneously ...