Concept

Active packaging

Publications associées (42)

Rapidly verifiable aggregate signatures

Rachid Guerraoui, Manuel José Ribeiro Vidigueira, Gauthier Jérôme Timothée Voron, Martina Camaioni, Matteo Monti, Pierre-Louis Blaise Roman

A method for aggregating digital signatures comprises the following steps carried out by a signature aggregator: receiving first data packages from signers, each first data package comprising a signer identifier, a payload, and a payload signature; verifyi ...

2024

Tunable biocomposite films fabricated using cellulose nanocrystals and additives for food packaging

Wenjing Sun, Cong Chen

Cellulose nanocrystals (CNCs) are considered a prospective packaging material to partially replace petroleumbased plastics attributed to their renewability, sustainability, biodegradability, and desirable attributes including transparency, oxygen, and oil ...

ELSEVIER SCI LTD2023

Lignin, from biomass waste to sustainable materials for food packaging, antiviral coatings and agriculture

Alice Boarino

Our planet has been challenged for years by our reckless use of fossil fuels, which has led to the ongoing climate change and energy crisis. The transition to the use of renewable alternative sources has now became urgent and inevitable. The valorization o ...

EPFL2023

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Elison de Nazareth Matioli

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Linear and nonlinear applications of miniaturized silicon nitride microresonators

Arslan Sajid Raja

Photonic integrated circuits (PICs) are the subject of massive interest due to the range of applications they can provide at a huge scale while building on well-established CMOS technologies. One of the critical parameters defining a technology's maturity ...

EPFL2023

Wafer-Level Vacuum Sealing for Packaging of Silicon Photonic MEMS

Niels Quack, Hamed Sattari, Alain Yuji Takabayashi, Göran Stemme

Silicon (Si) photonic micro-electro-mechanical systems (MEMS), with its low-power phase shifters and tunable couplers, is emerging as a promising technology for large-scale reconfigurable photonics with potential applications for example in photonic accele ...

SPIE-INT SOC OPTICAL ENGINEERING2021

Reversible and Broad-Range Oxygen Sensing Based on Purely Organic Long-Lived Photoemitters

Esther Amstad, René M. Rossi, Efe Armagan

The detection of oxygen (O-2) by optical sensors is of growing importance, for example, in biology, life science, environmental science, and aerodynamics, where the composition of gases is crucial for many applications. Purely organic optical O-2 sensors a ...

2021

The Scikit HEP Project - overview and prospects

Pratyush Das

Scikit-HEP is a community-driven and community-oriented project with the goal of providing an ecosystem for particle physics data analysis in Python. Scikit-HEP is a toolset of approximately twenty packages and a few "a ffiliated" packages. It expands the ...

E D P SCIENCES2020

Advances and Gaps in the Research of Environmental Impacts of Food Packaging Applications using LCA

Developing food packaging applications based on materials from renewable resources, such as biobased plastics, is considered as potential solution to reduce the environmental impacts of packaging. While each specific industry applies the Life Cycle Assessm ...

Paul Scherrer Institute, World Resources Forum2019

ROS-Neuro: A common middleware for BMI and robotics. The acquisition and recorder packages

José del Rocio Millán Ruiz, Luca Tonin, Stefano Tortora

Recent advances in the Brain-Machine Interface (BMI) and in the robotic fields allowed researchers to design a new generation of brain-actuated neuroprostheses to control a variety of assistive devices-ranging from powered wheelchairs to telepresence robot ...

IEEE2019

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