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Dynamic fragmentation phenomena involve two important mechanisms: atomic debonding and internal impacts among formed fragments. While the former, i.e. energy dissipation due to crack propagation, has been frequently studied both theoretically and numerical ...
To date, there have been few reports of fatigue problems in medium-span reinforced or prestressed concrete road bridges, primarily due to the high ratio of the dead load to live load in such structures. Where fatigue problems have arisen, they have general ...
PbTiO3 thin films were epitaxially grown on (001) KTaO3 single crystal substrates by metalorganic chemical vapor deposition. The coherent epitaxial growth introduced a large in-plane tensile strain to the PbTiO3 film. This tensile strain increased T-C and ...
Today, the Mohs scale is used profusely throughout educational systems without any persuasive understanding of the fundamental principles. Why one mineral has a scratch hardness over the next culminating in a scale of 1 (chalk) to 10 (diamond) has no atomi ...
Today, the Mohs scale is used profusely throughout educational systems without any persuasive understanding of the fundamental principles. Why one mineral has a scratch hardness over the next culminating in a scale of 1 (chalk) to 10 (diamond) has no atomi ...
We measure, using an adaptation of a method designed for ceramic ball bearings, the local strength of a brittle second phase that serves to reinforce a metal. The method uses focused ion beam milling and a nanoindentation device, and is free of artifacts c ...
Bismuth ferrite, BiFeO3, is an important multiferroic material that has attracted remarkable attention for potential applications in functional devices. While thin films of BiFeO3 are attractive for applications in nanoelectronics, bulk polycrystalline BiF ...
This thesis provides reliable methods and building blocks in order to realize smart SiF by combining Si- with foil-based components on flexible substrates. Building blocks such as 2-D and 3-D electrical interconnections, hybrid integration techniques and e ...
This paper discusses the findings of an experimental program that was conducted to investigate the behaviour of extended shear tab beam-to-column and beam-to-girder connections that are commonly used in North America. The laboratory results showed that ext ...
In this paper, a low temperature flip-chip integration technique for Si bare dies is demonstrated on flexible PET substrates with screen-printed circuits. The proposed technique is based on patterned blind vias in dry film photoresist (DP) filled with isot ...
