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A process for producing a metal article containing at least 10% interconnected porosity, using a preform (11), comprising: mixing an organic binder, a wetting agent and a granular material, to obtain a mouldable paste that combines 10 vol. pct. or more of ...
Piezoresistive sensors based on steel and other metallic substrates provide higher strain response than on standard ceramic substrates and are more easily packaged. But exposing high-strength steels to the standard high- temperature 850°C thick-film firing ...
We investigate the ferromagnetic resonance of Co/Cu/Co trilayers by use of AC-spin-transfer torque excitations. Magnetic structures are grown in a 6-mu m-thick commercial nanoporous polycarbonate membranes by use of electrodeposition in a cobalt/copper sin ...
Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...
High-porosity dunite channels are important pathways for melt migration in the mantle. To better understand the first order characteristics of the high-porosity melt channel and its associated peridotite lithologies in an upwelling mantle, we conducted hig ...
The reasons for the lower piezoelectric properties in the most studied lead-free piezoelectrics, modified (K,Na)NbO3 and (Bi0.5Na0.5)TiO3, are discussed. Contributions from domain wall motion and properties at the morphotropic phase boundary are considered ...
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
A novel method is demonstrated to tailor the electronic structure of high-Z surface alloys showing a giant Rashba splitting by means of electron doping. This aims for new model systems to study unconvential spin topologies and for possible applications in ...
Copper and copper alloys typically experience a sharp loss in ductility at intermediate temperature, induced by grain boundary damage and fracture processes. The susceptibility of the material to intermediate temperature embrittlement is, as a result, stro ...
Recent developments in thick-film technology have seen the widespread introduction of lead- free alternative to traditional conductive, dielectric and overglaze compositions. Resistors, however, have lagged behind this trend, as developing balanced and wel ...
