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Publications associées (180)

Two-dimensional electron gas density in Al1-xInxN/AlN/GaN heterostructures (0.03

Nicolas Grandjean, Jean-François Carlin, Eric Feltin, Marcel Py, Marcus Gonschorek

Compared to the AlGaN alloy, which can only be grown under tensile strain on GaN, the AlInN alloy is predicted by Vegard's law to be lattice-matched (LM) on fully relaxed GaN templates for an indium content of similar to 17.5%, i.e., it can be grown either ...

2008

Growth directions in directionally solidified Al-Zn and Zn-Al alloys near eutectic composition

Michel Rappaz, Martin Rhême

Growth directions and crystallographic orientations of solidification microstructures have been measured in Al-Zn alloy near the eutectic composition. Al dendrites in Al-92 wt.% Zn alloy were found to grow along the I 10) directions while Zn dendrites in A ...

Elsevier2008

Ductile double-lap joints from brittle GFRP laminates and ductile adhesives. Part II: Numerical investigation and joint strength prediction

Thomas Keller, Julia De Castro San Roman Fest

Joint analysis using a non-linear finite element model has been performed to analyze the effects of adhesive ductility on the stiffness and strength of full-scale adhesively-bonded double-lap joints composed of brittle pultruded GFRP laminates. Experimenta ...

2008

Experimental and numerical studies on size and constraining effects in lead-free solder joints

John Botsis, Joël Cugnoni, Venkatesh Sivasubramaniam

Search String Advanced > Saved Searches > ARTICLE TOOLS Get PDF (641K) Save to My Profile E-mail Link to this Article Export Citation for this Article Get Citation Alerts Request Permissions More Sharing ServicesShare | Share on citeuli ...

2007

Method of manufacturing a module of photoelectrochemical cells with long-term stability

Described is a method of manufacturing a module with long-term stability even though it contains a non-heat-resistant material, in particular a photosensitizer. Two glass plates (1, 2) are connected to each other round their edges with an edge-sealing stru ...

2007

Laser soldering of LTCC hermetic packages with minimal thermal impact

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...

2007

Laser soldering of piezoelectric actuator with minimal thermal impact

Jacques Jacot, Thomas Maeder, Yannick Sébastien Fournier, Frank Seigneur

Mechanical and electrical connecting of piezoelectric actuator is often done using conductive glue. Its advantage is not to heat the piezoelectric actuator during connection. But there are many disadvantages to gluing; the main one is curing time. Welding ...

2007

Test results of a large size, forced flow Nb3Sn conductor, based on a design alternative to the cable-in-conduit

Pierluigi Bruzzone, Boris Stepanov, Rainer Wesche, Martin Vogel

An R&D program at CRPP investigates the design of large size Nb3Sn conductors, with the aim to improve the effectiveness and hence the cost of large size, force flow conductors. A design based on a solder filled flat cable, by react wind method, is selecte ...

2007

Examination of Be//Cu joints in hipped Be tiles by using Ion Beam Analysis methods

Cyril Cayron

Be has a tendency to form particularly brittle intermetallics with Cu and a lot of other elements. Insertion of interlayers may be a solution to increase bond quality. Ion Beam Analysis (IBA) methods have been considered together with scanning electron mic ...

2007

The constitutive response of brazing alloys and the residual stresses in ceramic-metal joints

Matteo Galli

Nowadays the joining of dissimilar materials is often the only solution to fulfill the complex requirements of high technology applications. One of the fields in which the research activity is more intense and promising is that of the brazing of ceramics w ...

EPFL2007

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