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Publications associées (28)

2D Material Based Inks For Room Temperature Printed Electronics

Functional printing is a versatile mass production method that has gained considerable scientific and industrial attention in the past few years. A wide range of electronics from passive circuit components (e.g., resistors and interconnects) to high-perfor ...

EPFL2021

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Mikhail Asiatici, Göran Stemme

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are ch ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2018

Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Peter Ryser, Thomas Maeder, Caroline Jacq, Maxime Blot

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Michail Zervas, Yusuf Leblebici, Yassir Madhour, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Fabrication Trials of Round Strands Composed of Coated Conductor Tapes

Pierluigi Bruzzone, Davide Uglietti, Rainer Wesche

Various techniques have been proposed in order to assemble coated conductor tapes into high current strands. In this work, the preparation of high current capacity round strands starting from industrial coated conductors has been investigated. Round, twist ...

2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Deformation and Damage in Lead-free Solder Joints

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Fabrication of Polymer-Based Micro Devices: Formulation and Study of the Paste

Peter Ryser, Thomas Maeder, Nathalie Sophie Adeline Serra, Olivier Gentsch

We investigate in the present work the fabrication of polymer-based micro-fluidic and micro-mechanical devices using sacrificial, resistive/conductive pastes, through a screen-printing process. An organic sacrificial paste is first screen-printed onto a su ...

Elsevier2011

Fabrication of polymer-based micro devices: formulation and study of the paste

Peter Ryser, Thomas Maeder, Nathalie Sophie Adeline Serra, Olivier Gentsch

Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2010

Fabrication of Polymer-Based Micro Devices: Formulation and Study of the Paste

Peter Ryser, Thomas Maeder, Nathalie Sophie Adeline Serra, Olivier Gentsch

Elsevier Science, Reg Sales Off, Customer Support Dept, 655 Ave Of The Americas, New York, Ny 10010 Usa2010

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