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This paper clarifies the terminologies used to describe the size effect on fatigue behaviour of welded joints. It summarizes the existing research on size effect in the perspective of newly defined terminologies. It identifies knowledge gaps in designing t ...
The consequences of the contact between liquid bismuth and a copper bicrystal are investigated at 500°C. Atoms of bismuth are shown to penetrate and embritlle the copper grain boundary. Grain boundary concentration profiles of bismuth are obtained on fract ...
A model Ni-Bi system has been used to investigate intergranular penetration (IGP) phenomenon. All experiments have been done on Ni 26° bicrystal at 700°C using bismuth vapour condensation as a source of liquid bismuth. Such a procedure results at room ...
Thick-film materials are very advantageous for piezoresistive pressure and force sensors because of ease of processing, reliability and low cost. However, their applications are restricted because standard thick-film materials require processing temperatur ...
In this paper, several probabilistic models for evaluating the fatigue performance of post-weld treated tubular bridge structures are briefly described. The application of the models is then demonstrated on a full-scale example bridge. Under realistic traf ...
The processing and application of graphite powder-based sacrificial layer for fabrication of microfluidic structures in LTCC is described. Such layers are produced as pastes, which are screen-printed in LTCC sheets to avoid sagging, by supporting closed, t ...
Chemical inertness and corrosion resistance make ceramic materials appropriate for Micro Electro-Mechanical Systems (MEMS) when aiming for sensing applications at high temperature or in harsh environment. Besides the usual fabrication techniques, such as p ...
In the design of tubular bridges, engineers have found the fatigue performance of the joints to be a critical aspect that may have a significant impact on the economic viability of these structures. In looking for ways of improving this performance, the us ...
Mode I crack growth along some grain boundaries of copper embrittled by solute segregation shows strong anisotropy. For instance, growth along the direction on the symmetrical tilt boundary has been reported to occur by intergranular brittle fracture, wher ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...