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Supramolecular interactions play an important role in defining the structure and the resulting mechanical properties of materials. For instance, interchain hydrogen-bonding in PAs gives them superior strength and stiffness in engineering materials, while t ...
A new Room Temperature (RT) 0-level vacuum package is demonstrated in this work, using amorphous silicon (aSi) as sacrificial layer and SiO2 as structural layer. The process is compatible with most of MEMS resonators and Resonant Suspended-Gate MOSFET [1] ...
Facades are the primary interface controlling the flow of solar energy in buildings and affecting their energy balance and environmental impact. Recently, large-scale 3D printing (3DP) of translucent polymers has been explored as a technique for fabricatin ...
The ultimate control over chain self-assembly is key to unravel and optimize the relationship between film microstructure and charge carrier mobility in solution processable conjugated polymer semiconductors. Here we employ preparatory size exclusion chrom ...
This paper presents a novel process for screen printed electrode fabrication, functionalization and integration in a polyethylene terephthalate (PET) fluidics system for electrochemical analysis. The innovative components utilized are: 1. 3D Through-Foil V ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
Dielectric Barrier Discharges (DBD) have been used for more than a century, especially for ozone production. Research conducted within the last twenty years has investigated the discharge mechanisms involved and the different discharge regimes observable ( ...