Publications associées à Thermal management (electronics)

Multiphysics simulation of corona discharge induced ionic wind

Ivica Stevanovic, Nicola Parolini, Francesco Agostini

Ionic wind devices or electrostatic fluid accelerators are becoming of increasing interest as tools for thermal management, in particular for semiconductor devices. In this work, we present a numerical model for predicting the performance of such devices; ...

American Institute of Physics2013

Advances in Electronics Cooling

John Richard Thome, Jackson Braz Marcinichen, Jonathan Olivier, Nicolas Lamaison

This article highlights the advantages of on-chip microchannel cooling technology, based on first-and second-law analysis and experimental tests on two types of cooling cycles, the first driven by an oil-free liquid pump and the second by an oil-free vapor ...

Taylor & Francis2013

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

David Atienza Alonso, Arvind Raj Mahankali Sridhar, Ayse Kivilcim Coskun, Jie Meng

Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel-based liquid cooling, however, can substantially increase the on-chip thermal gradients, ...

Institute of Electrical and Electronics Engineers2013

Dendritic Growth Morphologies in Al-Zn Alloys-Part II: Phase-Field Computations

Michel Rappaz, Jonathan Friedli, Jonathan Dantzig, Paolo Di Napoli

In Part I of this article, the role of the Zn content in the development of solidification microstructures in Al-Zn alloys was investigated experimentally using X-ray tomographic microscopy. The transition region between dendrites found at low Zn content a ...

Springer Verlag2013

INTERNAL STRESS GENERATION DURING QUENCHING OF THICK HEAT TREATABLE ALUMINIUM ALLOYS

Jean-Marie Drezet, Helena Van Swygenhoven, Nicolas Paul Henry Chobaut, Patrick Schloth

In the current trend toward thicker aluminium plates, a major concern is the stress build-up during quenching which causes distortions during machining. Indeed, cooling rates are not high enough, especially at the core of such thick plates, to prevent any ...

TMS2013

Modeling of peritectic coupled growth in Cu-Sn alloys

Michel Rappaz, Jonas Valloton, Jonathan Dantzig

In directional solidification experiments on hypoperitectic Cu-Sn alloys at low velocity and high thermal gradient, both lamellar and fibrous coupled peritectic growth patterns have been observed. Two phenomena that had not been observed in previous experi ...

Elsevier2013

Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation

David Atienza Alonso, Arvind Raj Mahankali Sridhar

While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced therma ...

ACM and IEEE Press2012

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Peter Ryser, Thomas Maeder, Fabrizio Vecchio, Conor Joseph Slater

The continuing trend in the automotive and aviation industries to reduce complexity of electronic systems by removing cooling results in a need for high temperature electronics and associated packaging technologies. To ensure reliability over long periods ...

IMAPS / ACerS2012

Cost-effective thermally-managed 1.55-μm VECSEL with hybrid mirror on copper substrate

Elyahou Kapon, Alexandru Mereuta, Alexei Sirbu

An electroplated copper substrate was evaluated for heat dissipation in 1.55-μm optically pumped vertical extended cavity surface emitting lasers (OP-VECSELs). It is a cost-effective and flexible solution compared with the previously proposed chemical vapo ...

2012

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Thermal management (electronics)

Multiphysics simulation of corona discharge induced ionic wind

Heat Management for Process Intensification of Fast Exothermic Reactions in Microstructured Reactors

Advances in Electronics Cooling

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Dendritic Growth Morphologies in Al-Zn Alloys-Part II: Phase-Field Computations

INTERNAL STRESS GENERATION DURING QUENCHING OF THICK HEAT TREATABLE ALUMINIUM ALLOYS

Modeling of peritectic coupled growth in Cu-Sn alloys

Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Cost-effective thermally-managed 1.55-μm VECSEL with hybrid mirror on copper substrate

Graph Chatbot

Chattez avec Graph Search

Heat Management for Process Intensification of Fast Exothermic Reactions in Microstructured Reactors

INTERNAL STRESS GENERATION DURING QUENCHING OF THICK HEAT TREATABLE ALUMINIUM ALLOYS

Multiphysics simulation of corona discharge induced ionic wind

Dendritic Growth Morphologies in Al-Zn Alloys-Part II: Phase-Field Computations

Characterisation of test vehicle for in-situ measurement of die attach thermal conductivity

Thermal Balancing of Liquid-Cooled 3D-MPSoCs Using Channel Modulation

Cost-effective thermally-managed 1.55-μm VECSEL with hybrid mirror on copper substrate

Modeling of peritectic coupled growth in Cu-Sn alloys

Advances in Electronics Cooling

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation