Concept

Techniques de l'estampe

Publications associées (79)

Dynamic stencil lithography on full wafer scale

Jürgen Brugger, Andreea Veronica Savu, Marc Antonius Friedrich van den Boogaart

In this paper, the authors present a breakthrough extension of the stencil lithography tool and method. In the standard stencil lithography static mode, material is deposited through apertures in a membrane (stencil) on a substrate which is clamped to the ...

2008

Simplified Ink Spreading Equations for CMYK Halftone Prints

Roger Hersch, Thomas Bugnon, Mathieu Brichon

The Yule-Nielsen modified spectral Neugebauer model enables predicting reflectance spectra from surface coverages. In order to provide high prediction accuracy, this model is enhanced with an ink spreading model accounting for physical dot gain. Traditiona ...

2008

Metallic Nanowires by Full Wafer Stencil Lithography

Jürgen Brugger, Luis Guillermo Villanueva Torrijo, Andreea Veronica Savu, Marc Antonius Friedrich van den Boogaart, Oscar Vazquez Mena, Katrin Sidler Arnet

Aluminum and gold nanowires were fabricated using 100 mm stencil wafers containing nanoslits fabricated with a focused ion beam. The stencils were aligned and the nanowires deposited on a substrate with predefined electrical pads. The morphology and resist ...

2008

Predicting mask distortion, clogging and pattern transfer for stencil lithography

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart

One of the ultimate tasks for stencil lithography is the ability to fabricate arrays of structures with controlled dimensions on the nanometer scale precisely positioned on a suitable surface. The race to shrink feature sizes requires the limits of convent ...

2007

Dynamic Stencil Lithography

Recent developments are going towards miniaturized devices and structures. Besides advanced photolithography techniques, complementary patterning methods are evolving. Among them is the nanostencil technique. This technique is about defining patterns under ...

2006

Modification of Thick-film Conductors Used in IP Technology for Reduction of Warpage during Co-firing of LTCC (Low Temperature Co-fired Ceramic) Modules

Peter Ryser, Thomas Maeder, Hansu Birol

LTCC technology offers low temperature firing (

Trans Tech Publications2006

Directed assembling of gold nanoparticles using Van der Waals interactions

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart

In the last past years, many promising applications of nanoparticles in quantum electronics such as nanocrystal memories, chemical sensors or nanodevices based on single electron tunneling and Coulomb blockade effects have attracted much attention. Nanopar ...

2006

Stenci Lithography: Status and Prospectives

Jürgen Brugger, Marc Antonius Friedrich van den Boogaart, Oscar Vazquez Mena, Nao Takano

Stencil lithography is a surface patterning technique that relies on the local deposition of material through miniaturized shadow mask membranes. This method has been used since many years in various implementations for the formation of patterns (mainly st ...

2006

ELECTROSTATIC CLAMPING CHUCK FOR NANOSTENCILS

Jürgen Brugger, Hannes Bleuler, Marc Antonius Friedrich van den Boogaart

There is growing interest in using alternative, resistless patterning techniques. Stencil lithography or shadow masking is one of the possible solutions. By means of physical vapor deposition many different materials can be evaporated in vacuum and pattern ...

2006

Compatibility of screen-printing technology with micro-hotplate for gas sensor and solid oxide micro fuel cell development

Nico de Rooij, Danick Briand

Screen-printing technology is widely used in the field of gas sensors and can also be used to fabricate electrodes for solid oxide fuel cell (SOFC). The compatibility of this technique with micro-hotplate is studied to produce micro sensors and micro SOFC. ...

2006

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