Resist

Résumé

A resist, used in many areas of manufacturing and art, is something that is added to parts of an object to create a pattern by protecting these parts from being affected by a subsequent stage in the process. Often the resist is then removed. For example in the resist dyeing of textiles, wax or a similar substance is added to places where the dye is not wanted. The wax will "resist" the dye, and after it is removed there will be a pattern in two colours. Batik, shibori and tie-dye are among many styles of resist dyeing. Wax or grease can also be used as a resist in pottery, to keep some areas free from a ceramic glaze; the wax burns away when the piece is fired. Song dynasty Jizhou ware used paper cut-outs and leaves as resists or stencils under glaze to create patterns. Other uses of resists in pottery work with slip or paints, and a whole range of modern materials used as resists. A range of similar techniques can be used in watercolour and other forms of painting. While the

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https://en.wikipedia.org/wiki/Resist

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Micro- and nanofabrication can be taught to students and professionals by textbooks and ex-cathedra lectures, but the real learning comes from seeing the manufacturing steps as they happen. This MOOC will not only explain the basics of microfabrication but also show the practice through videos.

In this course we will see an overview of the exciting field of Micro and Nanomechanical systems. We will go over the dfferent scaling laws that dominate the critical parameters, how size affects material properties, how these devices are manufactured, designed and later used.

This course gives the basics for understanding nanotechnology from an engineer's perspective: physical background, materials aspects and scaling laws, fabrication and imaging of nanoscale devices.

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Séances de cours associées (18)

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Interaction of pulsed VUV radiation with CVD TiO2 thin films. The resist problem.

2003

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Experimental study of the strain patterned in 2D materials using thermal nanoimprint lithography

Johannes Mathis Valentin Lemonde

Since straining semiconductors can enhance the carriers’ mobility and thus improve optoelectronic properties, this project aims at determining whether t-NIL can be used in order to strain thin flakes of MoS2 out of the plane. In this approach, the thin flakes are placed between the stamp of the nanoimprinter and the soft polymeric resist into which the imprinting is performed. Due to the fineness of the 2D material, the imprinting is not hindered, and, thanks to Van der Waals forces, the thin layer would remain against the imprinted resist upon stamp withdrawal, effectively building strain by the out-of-plane stretching. The strain built in the thin flakes is estimated through the redshift of the Raman spectra of the two peaks corresponding to two of the vibrational modes of the lattice of the MoS2 crystal. The characteristics of the imprints being highly dependent on the stamps’ features’ profiles, preliminary investigations useful for the future design of efficient stamps have been directed. Using a stamp with features exhibiting trapeziform cross-sections with leg slopes up to 8%, corresponding in theory to 0.32% strain, redshifts obtained for the E12g and A1g peaks reached 0.27 cm⁻¹ and 0.24 cm⁻¹ respectively. Another imprint using a stamp with leg slopes up to 170 % broke the 2D flakes, the theoretical strain exceeding the yield strength by far. In order to increase the strain achieved in the thin flakes, the effect of the stamp profiles ought now to be studied further. A hypothesis would be that the slope of the sides of the profile of the stamps’ features could be related to the strain built into the 2D material.

2021

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Mechanical characterization of a new high-aspect-ratio near UV-photoresist

Philippe Renaud

Characterization of the mechanical and thermal properties of the high aspect- ratio, negative, UV resist, SU-S has been carried out. This resist allows for a broad range of thicknesses to be obtained with a single spin process. Standard exposure with a UV aligner has produced outstanding aspect ratios, 15 for lines and trenches. This type of performance lends itself well to MEIMS applications, packaging, micromolds, spacers, etc. Because of the simplicity of use of the resist in addition to the large range of possible applications, the process dependent mechanical and thermal properties must be understood in order to completely exploit the potential of the resist.

1998

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