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Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...
Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...
Wafer-scale nanostencil lithography (nSL) is used to define several types of silicon mechanical resonators, whose dimensions range from 20 μm down to 200 nm, monolithically integrated with CMOS circuits. We demonstrate the simultaneous patterning by nSL of ...
Molecular beam epitaxy Ga-assisted synthesis of GaAs nanowires is demonstrated. The nucleation and growth are seen to be related to the presence of a SiO2 layer previously deposited on the GaAs wafer. The interaction of the reactive gallium with the SiO2 p ...
High efficiency Si heterojunction (HJ) solar cells must exhibit low interface recombination, as it limits the cell open circuit voltage (VOC). The study of the interface recombination of various a-Si:H/c-Si lifetime test samples gives insight into the reco ...
Networks on Chip (NoC) has been proposed as a scalable and reusable solution for interconnecting the ever- growing number of processor/memory cores on a single silicon die. As the hardware complexity of a NoC is significant, methods for designing a NoC wit ...
One of the biggest challenges that are facing the Very Large Scale Integrated Circuits (VLSI) technologies today is the significant performance gap (3× to 9×) between full custom circuits and Application Specific Integrated Circuits (ASICs) designed in the ...
We developed high-density microfluidic chips that contain plumbing networks with thousands of micromechanical valves and hundreds of individually addressable chambers. These fluidic devices are analogous to electronic integrated circuits fabricated using l ...
Using the epitaxy-on electronics (EoE) process, self-electrooptic effect devices (SEED's) have been monolithically integrated with VLSI GaAs electronics., The EoE approach provides both depletion-mode and enhancement-mode MESFET's for large-scale, high-den ...
Recently, artificial intelligence (AI) systems gain an increasing popularity and their development is fast. One of the most important fields of the AI system development are artificial neural networks (ANN’s) which, due to continuous progress in microelect ...
