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A novel laser soldering method for hermetic packaging of temperature sensitive devices such as organic electronics, micro- and nanostructures is presented in this work. The package combines a thermally optimized LTCC (Low Temperature Co-fired Ceramic) base ...
The need for efficient security systems led to the development of automatic behavioral identification tools using video tracking. However, in the field of mobile robotics, trajectories are seldom taken into account to qualify robot behavior. Most metrics r ...
2007
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At small sizes, piezoelectric bending actuators are more practical and have more favorable downscaling properties than traditional electromagnets in the field of microfluidics. However, their application is limited by the difficulty of ensuring proper clam ...
2007
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Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
2006
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In video surveillance and sports analysis applications, object trajectories offer the possibility of extracting rich information on the underlying behavior of the moving targets. To this end we introduce an extension of Point Distribution Models (PDM) to a ...
CVC2005
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In recent years, the advent of robust tracking systems has enabled behavioral analysis of individuals based on their trajectories. An analysis method based on a Point Distribution Model (PDM) is presented here. It is an unsupervised modeling of the traject ...
2006
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The sensor, to determine the concentration of glucose in blood, is implanted within an ampoule (1) containing a sensitive liquid. Glucose can penetrate into the ampoule through its cellulose mantle (2), where the viscosity of the liquid and glucose mixture ...
This paper describes a software architecture for industrial robots used in manufacturing equipment. In order to achieve software portability, the application software is dissociated from the low-level robot controller software. The interaction between thes ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
2006
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Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
