Publications de Adrien Bidiville

Wire-sawing processes: parametrical study and modeling

Christophe Ballif, Mathijs Pieter van der Meer, Adrien Bidiville

Reducing the wafer breakage rate without changing the wafer thickness and sawing thinner wafers while maintaining constant breakage rate are two possibilities to decrease the costs of solar cells. They are similar in the sense that both require stronger wa ...

Elsevier2015

Effect of debris on the silicon wafering for solar cells

Christophe Ballif, Adrien Bidiville

The wafers used by the photovoltaic industry are mostly produced by multi-wire slurry sawing. One of the key factors determining the wafer quality (presence of saw marks and chips, increased roughness, wafer thickness variations and wafer strength) is the ...

Elsevier2011

Mechanisms of wafer sawing and impact on wafer properties

Christophe Ballif, Mathijs Pieter van der Meer, Johann Michler, Adrien Bidiville

Silicon wafer wire-sawing experiments were realized with different sets of sawing parameters, and the thickness, roughness, and cracks depth of the wafers were measured. The results are discussed in relation to assumptions underlying the rolling-indenting ...

Wiley-Blackwell2010

Diamond wire-sawn silicon wafers - from the lab to the cell production

Christophe Ballif, Adrien Bidiville

Wafers for the PV industry are mainly sawn with a multi-wire slurry saw. This process is slow (it takes almost half a day to complete a cut) and generates a lot of waste: around half the silicon is sawn away and contaminating the slurry, and the wire is wo ...

2009

Effects of edge defects induced by multi-wire sawing on the wafer strength

Christophe Ballif, Mathijs Pieter van der Meer, Adrien Bidiville, Fanny Alexia Jeanneret

The focus of the photovoltaic industry is a continuous reduction of the cost of solar energy. Lowering the wafer thickness during the processing by means of multi-wire slurry saw technology is one of the key issue to reduce these costs. However, reducing t ...

2008

Influence of abrasive concentration on the qualiy of wire-sawn silicon wafers

Christophe Ballif, Mathijs Pieter van der Meer, Adrien Bidiville

The sawing parameters have an impact on the depth of the defects in the wafers, and hence on their mechanical strength. However, as sawing is a highly complex system, the wafering industry is still relying on a “trial and error” approach to improve the saw ...

2008