Personne
Léa Deillon
Cette personne n’est plus à l’EPFL
Publications associées (13)
Growth of intermetallic compounds in the Au-In system: Experimental study and 1-D modelling
Michel Rappaz, Aïcha Hessler-Wyser, Léa Deillon
The gold indium system is of primary interest for bonding processes such as solid liquid interdiffusion bonding. In order to optimize the manufacturing parameters, it is essential to know which intermetallic compounds (IMCs) are formed when solid Au and li ...
Elsevier2014Soudure par interdiffusion dans les systèmes Au-In et In-Ni
Hermiticity is an essential requirement of a MEMS package for a device to work properly. Hermeticity also must be preserved during the operations following packaging, during which the package bond should not remelt. Bonding temperature is limited however t ...
EPFL2012Intergranular penetration of liquid gold into stainless steel
Michel Rappaz, Denis Favez, Léa Deillon, Jean-Daniel Wagnière
Intergranular penetration of liquid 18 K gold into a superaustenitic stainless steel, which occurs during laser welding of these two materials, has been studied using a C-ring device which can be put under tensile stresses by a screw. It is shown that liqu ...
Elsevier2011