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Somayyeh Rahimian Omam

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Publications associées (10)

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Three-dimensional (3-D) or vertical integration is a design and packaging paradigm that can mitigate many of the increasing challenges related to the design of modern integrated systems. 3-D circuits have recently been at the spotlight, since these circuit ...

EPFL2015

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Compared to Application-Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) provide reconfigurablity at the cost of lower performance and higher power consumption. Exploiting a large number of programmable switche ...

IEEE2015

Low Power FPGAs Based on Resistive Memories

Giovanni De Micheli, Pierre-Emmanuel Julien Marc Gaillardon, Pascal Andreas Meinerzhagen, Xifan Tang, Somayyeh Rahimian Omam

During the last three decades, reconfigurable logic has been growing steadily and can now be found in many different fields. Field programmable gate arrays (FPGAs) are one of the most famous architecture families of reconfigurable devices. FPGAs ca ...

CRC Press2015

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Field Programmable Gate Arrays (FPGAs) rely heavily on complex routing architectures. The routing structures use programmable switches and account for a significant share in the total area, delay and power consumption numbers. With the ability of ...

IEEE2015

Parallel vs. Serial Inter-plane communication using TSVs

Giovanni De Micheli, Yusuf Leblebici, Somayyeh Rahimian Omam

3-D integration is a promising prospect for implementing high performance multifunctional systems-on- chip. Through Silicon Vias (TSVs) are the enablers for achieving high bandwidth paths in inter-plane communications. TSVs also provide higher vertical lin ...

2014

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Clock distribution networks consume a considerable portion of the power dissipated by synchronous circuits. In conventional clock distribution networks, clock buffers are inserted to retain signal integrity along the long interconnects, which, in turn, sig ...

American Scientific Publishers2013

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Designing a low power clock network in synchronous circuits is an important task. This requirement is stricter for 3-D circuits due to the increased power densities. Resonant clock networks are considered efficient low power alternatives to con- ventional ...

2012

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2012

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Three-dimensional (3-D) integration is an emerging candidate for implementing high performance multifunctional systems-on-chip. Employing an efficient medium for data communication among different planes is a key factor in achieving a high performance 3-D ...

American Scientific Publishers2012

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Springer-Verlag2011