Diseño de redes en chip de propósito específico con información de rutado físico
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With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...
In a semiconductor market dominated by portable consumer applications, embedded flash memory technology has experienced a rapid diffusion. It is now considered the preferred solid-state memory solution for its non-volatile characteristics, high read and wr ...
Important texts about the work of OMA (and by Rem Koolhaas himself) have been written in English. In this article, the reception in the Dutch-speaking world is examined, from 1978 until 1990. As the writings of critics such as Geert Bekaert, Hans van Dijk, ...
Heat removal and power density distribution delivery have become two major reliability concerns in 3D stacked technology. In this paper, we propose a thermal-driven 3D floorplanner. Our contributions include: (1) a novel multi-objective formulation to cons ...
We present a new programmable neighborhood mechanism for hardware implemented Kohonen self-organizing maps (SOMs) with three different map topologies realized on a single chip. The proposed circuit comes as a fully parallel and asynchronous architecture. T ...
Institute of Electrical and Electronics Engineers2011
In a bilingual paper entitled 'Bibliometrics as weapons of mass citation - La bibliometrie comme arme de citation massive',([1]) recently translated into English,([2]) we have argued that the current fashion of ranking people, papers and journals is anythi ...
Systems on Chip (SoCs) and Systems in Package (SiPs) are key parts of a continuously broadening range of products, from chip cards and mobile phones to cars. Besides an increasing amount of digital hardware and software for data processing and storage, the ...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
Networks-on-Chip (NoCs) are a promising interconnect paradigm to address the communication bottleneck of Systems-on-Chip (SoCs). Wormhole flow control is widely used as the transmission protocol in NoCs, as it offers high throughput and low latency. To mat ...
An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated m ...