Combined Al-protection and HF-vapour release process for ultrathin cantilevers
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The evaporation through shadow masks (nanostencils) overcomes the limitations typically given by the patterning methods involving conventional optical lithography and etching, such as diffraction limits and etch-selectivity. It allows making low-cost nanop ...
The use of shadow masks (stencils) for nanopatterning overcomes the limitations typically present by patterning methods involving conventional optical lithography and etching, such as diffraction limit and etch selectivity. Nanostencils allow for resistles ...
We report on the growth and optical properties of dense arrays of single GaAs/AlGaAs quantum dot (QD) heterostructures with pitches as small as 300 nm. The samples were grown by organometallic chemical vapor deposition in dense inverted pyramids on {1 1 1} ...
Evaporation through shadow masks (nanostencils) overcomes the limitations typically given by patterning methods involving conventional optical lithography and etching, such as diffraction limits and etch-selectivity. This paper demonstrates the fabrication ...
A new tool of surface patterning technique for general purpose lithography was developed based on shadow mask method. This paper describes the fabrication of a new type of miniaturized shadow mask. The shadow mask is fabricated by photolithography and etch ...
We describe a combination of 100-mm wafer scale deep-ultraviolet (DUV) exposure and a microelectromechanical systems (MEMS) process to fabricate silicon nitride membranes with submicrometer apertures to be used as miniature shadow masks or nanostencils. Ap ...
We report an all-dry, two-step, surface nanoengineering method to fabricate nanomechanical elements without photolithography. It is based on the local deposition through a nanostencil of a well-defined aluminum pattern onto a silicon/silicon-nitride substr ...
A rapid and simple method to fabricate tiny shadow-masks and their use in multi-layer surface patterning with in situ micromechanical alignment is presented. Instead of using silicon micromachining with through-wafer etching to define the thin membrane wit ...
Processing issues for the fabrication of capacitive micromachined ultrasonic transducer (cMUT) arrays have been studied using surface micromachining. This work focuses on the critical steps of process fabrication such as membrane formation, sacrificial lay ...
A new method to release MEMS chips from a wafer without dicing is presented. It can be applied whenever SOI wafers are used that are structured from both the device and the handle side using DRIE. This method enables the release of extremely fragile struct ...