Combined Al-protection and HF-vapour release process for ultrathin cantilevers
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This paper presents a novel technological and design study of optical guided- wave MicroElectroMechanical Systems (MEMS) switch. We work on a concept of hermetic assembly in which a MEMS wafer is covered (top-down) by a crossing optical waveguide wafer. Th ...
We report on the fabrication of atomic force microscopy (AFM) probes using a novel technology that performs every machining step by means of one single deep reactive ion etching (DRIE) equipment. Specific etching conditions are optimized in order to define ...
The development of nanodevices demands for patterning methods in the nanoscale. To bring nanodevices to the market, there is a need for fast, low-cost nanopatterning methods. In addition, an increased flexibility is important for the engineering of multima ...
Increased flexibility of patterning methods is important for the engineering of multimaterial and multifunctional nano/micro-electro-mechanical systems (NEMS/MEMS), such as polymer-based electronic and sensor devices, 3D microfluidic systems, and bio-analy ...
Using Grazing-incidence small-angle scattering (GISAXS) technique we investigated the surface morphology of polymer films spin-coated on different silicon substrates. As substrates we used either technologically smooth silicon wafers or the same silicon wa ...
A simplified process to fabricate high aspect ratio nanostructures in silicon combining electron beam lithography and deep reactive ion etching (DRIE) is presented. A stable process (HARSiN) has been developed without the need for complicated resist/hard m ...
The four-point probe is used for the measurement of the resistivity of thin metal or semiconductor films. There is an interest in miniaturization of the probes to obtain higher surface sensitivity, an increased spatial resolution and less damage to the sam ...
This paper describes a system of silicon microneedle electrode arrays for electroporation with integrated temperature and fluidic system for drug delivery. In this research we have developed microneedle fabrication processes in standard silicon wafer utili ...
We describe a combination of 100-mm wafer scale deep-ultraviolet (DUV) exposure and a microelectromechanical systems (MEMS) process to fabricate silicon nitride membranes with submicrometer apertures to be used as miniature shadow masks or nanostencils. Ap ...
In this paper, the design and the characterization of batch fabricated SixNy micropipette arrays with diameters ranging from 6 νm down to 250 nm are described. The process used to fabricate the micromachined pipettes includes a deep reactive ion etching st ...