A granular model of solidification as applied to hot tearing
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The contributions assembled in the present volume proceed from the lectures of the 2009 ALERT Geomaterials School devoted to the Failure in the multiphase geomaterials. The multiphase behaviour of geomaterials used to be mainly considered from the point of ...
We present a two-dimensional granular model for the mechanical behavior of an ensemble of globular grains during solidification. The grain structure is produced by a Voronoi tessellation based on an array of predefined nuclei. We consider the fluid flow ca ...
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The solidification of an aluminum-copper alloy has been simulated in 3D using a granular model. Compared to previous similar 2D approaches for where only one phase is continuous, the extension to 3D allows for concurrent continuity of the solid and liquid ...
Minerals, Metals & Materials Soc, 184 Thorn Hill Rd, Warrendale, Pa 15086-7514 Usa2009
Two important factors affecting hot tearing - semi-solid constitutive behaviour and grain percolation - have been simulated through the use of microstructure models based on granular structures. The semi-solid model geometry is based on a modified Voronoi ...
Hot tearing, a severe defect occurring during solidification is the conjunction of tensile stresses which are transmitted to the mushy zone by the coherent solid underneath and of insufficient liquid feeding to compensate for the volumetric change. The RDG ...
Th. Böllinghaus, H. Herold, C. E. Cross and J.C Lippold2008
The origin of intragranular variations of the crystallographic orientation in hot-dip Al-Zn-Si coatings is discussed based on new experimental results and modelling. The solidification microstructure in as-received 55Al-43.4Zn-l.6Si (in wt.%) coatings depo ...
The tensile mechanical response of three semi-solid as-cast aluminum alloys - AA3104, AA6111, and CA31218 (an alloy similar in composition to AA3003) - was measured between a fraction solid f(s) similar to 0.85 and f(s) similar to 1 in order to establish t ...
lexible electronic devices are currently being developed using polymer substrates. Such devices present advantages like conformability, are light-weight and are expected to be manufactured in roll-to-roll (R2R) schemes accounting for cost-reduction. These ...