Automatic Monitoring of the Riddes Bridges using Electronic Inclinometers
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The high-entropy alloy (HEA) concept was based on the idea that high mixing entropy can promote formation of stable single-phase microstructures. During the past 15 years, various alloy systems have been explored to identify HEA systems with improved prope ...
Several boreholes were drilled for site comparison of a deep geological repository (DGR) in Northern Switzerland. The main target of the exploration program was the >100m thick Opalinus Clay, the designated host rock encountered at approximately 450 to 100 ...
Oxide Dispersed Strengthened (ODS) ferritic stainless steels present well-known fine grains microstructures where dislocation movement is hindered by a dense precipitation of nano-oxides particles. Previous research, on the thermomechanical behavior at hig ...
Metallic lithium and sodium are actively investigated as anodes for all solid-state batteries. While the mechanical properties of Li and Na remain poorly understood, there is a growing consensus that they play a crucial role in determining the integrity of ...
Mg and Ti alloys are attractive materials for structural applications in the transportation and biomedical industries due to their high strength-to-weight ratios. However, due to their hexagonally close-packed (HCP) lattice structure, they exhibit poor for ...
In this article, the hot deformation mechanism of a laser-welded near a TA15 Ti-alloy joint was studied by hot tensile tests conducted at temperatures ranging from 800 degrees C to 900 degrees C with strain rates ranging from 1.0 x 10(-1) s(-1) to 1.0 x 10 ...
The performance of two Nb3Sn conductors for the ITER central solenoids was tested. The current sharing temperatures (T-cs) were measured over 17 050 electromagnetic cycles, including four thermal cycles between 4.2 K and room temperature. T-cs declined alm ...
Microstructures in serpentine samples recovered from deformation experiments performed at high pressure (1-8 GPa), high temperature (150-500 degrees C), and laboratory strain rates (4 10(-4)-10(-6)s(-1)) were studied using transmission electron microscopy ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
We report on the diffraction peak shape evolution from cementite particles in three steel microstructures, recorded during in-situ tensile deformation at room temperature. We demonstrate that in a bainitic tempered steel the observed peak broadening and as ...
